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NLU1G04BMX1TCG

Onsemi

NLU1G04BMX1TCG by Onsemi

NLU1G04BMX1TCG by Onsemi is a CMOS Logic Gate with 14.5ns Propagation Delay, suitable for military-grade applications. It operates at a supply voltage range of 1.65V to 5.5V and can handle a load capacitance of 50pF, making it ideal for high-speed signal processing in compact electronic devices. The package style is small outline with very thin profile, featuring surface mount technology for easy integration into PCBs.

Median Price

$0.086

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

63,000

-

$0.092

$0.077

$0.068

DigiKey

USA . 63,000 parts In-Stock

1+ parts

-

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10k+ parts

$0.080

63,000

-

-

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$0.080

Verical

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.086

63,000

-

-

-

$0.086

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 742 parts In-Stock

1+ parts

$0.066

100+ parts

-

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-

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742

$0.066

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Digiode

USA . 1,390 parts In-Stock

1+ parts

$0.072

100+ parts

-

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10k+ parts

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1,390

$0.072

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 497 parts In-Stock

1+ parts

$0.066

100+ parts

-

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497

$0.066

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Corphita

USA . 2,406 parts In-Stock

1+ parts

$0.068

100+ parts

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2,406

$0.068

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Vigor

Singapore . 500 parts In-Stock

1+ parts

$0.070

100+ parts

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500

$0.070

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Continental Prestige Electronics

USA . 63,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.066

10k+ parts

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63,000

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$0.066

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SupplyDigital Components

Austria . 8,204 parts In-Stock

1+ parts

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Problanco Electronics

Mexico . 8,082 parts In-Stock

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Kulean Microsystems

USA . 4,554 parts In-Stock

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4,554

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TANS Electronics

Latvia . 913 parts In-Stock

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UHIMA Technologies

Türkiye . 841 parts In-Stock

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Microchip USA

USA . 208 parts In-Stock

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Overview

Discover the NLU1G04BMX1TCG by Onsemi, a top-quality logic gate designed to deliver exceptional performance in a compact package. With a fast propagation delay of 14.5 ns and a low power consumption, this product is perfect for a wide range of applications. Whether you're working on industrial automation, consumer electronics, or telecommunications, this logic gate offers reliability and efficiency like no other. Trust in Onsemi's reputation for excellence and elevate your projects with the NLU1G04BMX1TCG. Experience the difference today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard PCB designs and facilitates efficient integration into electronic systems.

Nominal Supply Voltage / Vsup (V): 3

Compatible with a common supply voltage of 3V, making it easy to integrate this product into existing circuit designs.

Load Capacitance (CL): 50 pF

Suitable for driving loads with a capacitance of up to 50 pF, making this product versatile for a wide range of applications.

Power Supplies (V): 1.8/5

Supports a range of power supply voltages (1.8V to 5V), offering flexibility in design and compatibility with various systems.

No. of Terminals: 6

Convenient number of terminals for connecting to external components and interfaces, simplifying the circuit design process.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact package style with a thin profile saves space on the PCB and allows for densely packed designs, ideal for miniaturized electronic devices.

Maximum I (ol): 4 Amp

High output current capability of 4A allows for driving larger loads, making this product suitable for applications requiring high current drive.

Maximum Operating Temperature: 125 °C

Wide operating temperature range up to 125 °C ensures reliable performance in harsh environmental conditions and industrial applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range down to -55 °C ensures reliable operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish provides excellent corrosion resistance and ensures reliable electrical connections over the product's lifespan.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic families, making this product energy-efficient and versatile.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum supply voltage of 5.5V, providing a safety margin for voltage spikes and ensuring reliable operation in a wide range of power supply conditions.

Technical Specifications

Logic Gates NLU1G04BMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1G04BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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