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NLU1G04CMX1TCG

Onsemi

NLU1G04CMX1TCG by Onsemi

NLU1G04CMX1TCG by Onsemi is a CMOS Logic Gate with 14.5ns Propagation Delay, suitable for military-grade applications. It operates at a supply voltage range of 1.65V to 5.5V and has a load capacitance of 50pF, making it ideal for high-speed signal processing in compact electronic devices. This surface-mount device features a small outline package with very thin profile, offering space-efficient solutions for various electronic designs.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 290,810 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

290,810

-

$0.119

$0.099

$0.088

DigiKey

USA . 290,810 parts In-Stock

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$0.100

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$0.100

Verical

USA . 164,810 parts In-Stock

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$0.110

164,810

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$0.110

Distributors (In-Stock)

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Vyrian

USA . 1,190 parts In-Stock

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$0.079

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-

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1,190

$0.079

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Digiode

USA . 1,628 parts In-Stock

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$0.093

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1,628

$0.093

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Distributors (Availability)

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Corohmni

South Africa . 139 parts In-Stock

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$0.079

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-

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139

$0.079

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Corphita

USA . 618 parts In-Stock

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$0.088

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618

$0.088

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Vigor

Singapore . 126 parts In-Stock

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$0.090

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126

$0.090

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Component Stockers USA

USA . 209,161 parts In-Stock

1+ parts

$0.100

100+ parts

$0.090

1k+ parts

$0.080

10k+ parts

$0.080

209,161

$0.100

$0.090

$0.080

$0.080

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$34.620

100+ parts

$31.504

1k+ parts

$28.388

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-

2,500

$34.620

$31.504

$28.388

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Continental Prestige Electronics

USA . 290,810 parts In-Stock

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$0.085

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290,810

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$0.085

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Kulean Microsystems

USA . 7,779 parts In-Stock

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Perfect Parts

USA . 6,507 parts In-Stock

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TANS Electronics

Latvia . 5,058 parts In-Stock

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SupplyDigital Components

Austria . 3,479 parts In-Stock

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Problanco Electronics

Mexico . 1,394 parts In-Stock

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UHIMA Technologies

Türkiye . 246 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic projects with the NLU1G04CMX1TCG by Onsemi, a top-quality logic gate that offers fast propagation delay at a nominal supply voltage of 3V. Manufactured by Onsemi, a trusted industry leader, this square-shaped surface mount device is perfect for applications requiring reliable signal processing. With a wide operating temperature range and robust construction, this logic gate ensures high performance and durability. Upgrade your designs with the NLU1G04CMX1TCG and experience seamless operation and superior functionality.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast signal processing and high performance.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly.

Nominal Supply Voltage / Vsup (V): 3

Suitable voltage supply for efficient operation.

Load Capacitance (CL): 50 pF

Ideal load capacitance for optimal circuit performance.

Power Supplies (V): 1.8/5

Supports multiple power supply options for flexibility in usage.

No. of Terminals: 6

Sufficient terminals for connectivity and integration into circuits.

Maximum I (ol): 4 Amp

High output current capability for driving loads.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for versatility in different environments.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold conditions without issues.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Logic Gates NLU1G04CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1G04CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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