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NLU1G07AMX1TCG

Onsemi

NLU1G07AMX1TCG by Onsemi

NLU1G07AMX1TCG by Onsemi is a CMOS Logic Gate with 14.5ns Propagation Delay, suitable for military applications. It operates at 5V with 50pF Load Capacitance and features OPEN-DRAIN output characteristics. This small outline package has a dual terminal position and can withstand temperatures from -55 to 125 °C.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,690 parts In-Stock

1+ parts

$1.130

100+ parts

$0.362

1k+ parts

$0.279

10k+ parts

-

2,690

$1.130

$0.362

$0.279

-

Rochester

USA . 143,885 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

143,885

-

$0.092

$0.077

$0.068

Verical

USA . 77,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.086

77,995

-

-

-

$0.086

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 79 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

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79

$0.072

-

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Chip Stock

USA . 53,000 parts In-Stock

1+ parts

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53,000

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Vyrian

USA . 4,676 parts In-Stock

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-

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4,676

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,274 parts In-Stock

1+ parts

$0.068

100+ parts

-

1k+ parts

-

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1,274

$0.068

-

-

-

Vigor

Singapore . 147 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

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147

$0.070

-

-

-

Corohmni

South Africa . 88 parts In-Stock

1+ parts

$0.076

100+ parts

-

1k+ parts

-

10k+ parts

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88

$0.076

-

-

-

Component Stockers USA

USA . 112,311 parts In-Stock

1+ parts

$0.080

100+ parts

$0.070

1k+ parts

$0.070

10k+ parts

$0.070

112,311

$0.080

$0.070

$0.070

$0.070

AZTECH Wire

Italy . 827 parts In-Stock

1+ parts

$21.690

100+ parts

-

1k+ parts

-

10k+ parts

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827

$21.690

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-

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Continental Prestige Electronics

USA . 143,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.066

10k+ parts

-

143,885

-

-

$0.066

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Perfect Parts

USA . 24,982 parts In-Stock

1+ parts

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24,982

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SupplyDigital Components

Austria . 6,210 parts In-Stock

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6,210

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Problanco Electronics

Mexico . 3,791 parts In-Stock

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3,791

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GreenTree Electronics

Israel . 2,690 parts In-Stock

1+ parts

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100+ parts

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2,690

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Authorized Procurement Solutions

USA . 2,690 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,690

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TANS Electronics

Latvia . 1,872 parts In-Stock

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1,872

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Kulean Microsystems

USA . 1,864 parts In-Stock

1+ parts

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1,864

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Microchip USA

USA . 451 parts In-Stock

1+ parts

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451

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UHIMA Technologies

Türkiye . 154 parts In-Stock

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154

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Overview

Enhance your electronic projects with the NLU1G07AMX1TCG by Onsemi, a top-quality logic gate that promises reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this product offers a wide range of applications in various electronics projects. With its fast propagation delay, low power consumption, and open-drain output characteristics, this logic gate provides unmatched value and benefits to customers looking for efficient and reliable solutions. Upgrade your projects today with the NLU1G07AMX1TCG and experience the advantages of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 14.5 ns

The low propagation delay ensures fast response times for signal processing.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with most systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures stable performance in various circuits.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

Can withstand low temperatures for reliable operation in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance.

Maximum Seated Height: 0.4 mm

Low profile design allows for compact integration into electronic devices.

Width: 1 mm

Small width ensures space-saving layout on circuit boards.

Minimum Supply Voltage (Vsup): 1.65 V

Can operate at low supply voltages for energy-efficient performance.

Terminal Pitch: 0.5 mm

The small terminal pitch simplifies PCB layout and assembly.

Technical Specifications

Logic Gates NLU1G07AMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1G07AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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