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NLU1G04AMX1TCG

Onsemi

NLU1G04AMX1TCG by Onsemi

NLU1G04AMX1TCG by Onsemi is a CMOS Logic Gate with 14.5 ns Propagation Delay, suitable for military applications. It operates at a supply voltage range of 1.65V to 5.5V, has a load capacitance of 50pF, and can handle a max I (ol) of 4A.

Median Price

$0.106

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,110 parts In-Stock

1+ parts

$1.230

100+ parts

$0.393

1k+ parts

$0.303

10k+ parts

-

1,110

$1.230

$0.393

$0.303

-

Rochester

USA . 980,725 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

980,725

-

$0.092

$0.077

$0.068

DigiKey

USA . 980,725 parts In-Stock

1+ parts

-

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-

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$0.120

980,725

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$0.120

Verical

USA . 930,000 parts In-Stock

1+ parts

-

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$0.086

930,000

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$0.086

Distributors (In-Stock)

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Digiode

USA . 1,784 parts In-Stock

1+ parts

$0.072

100+ parts

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1,784

$0.072

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Chip Stock

USA . 27,000 parts In-Stock

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27,000

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Vyrian

USA . 5,395 parts In-Stock

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5,395

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Distributors (Availability)

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Corphita

USA . 389 parts In-Stock

1+ parts

$0.068

100+ parts

-

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389

$0.068

-

-

-

Vigor

Singapore . 713 parts In-Stock

1+ parts

$0.070

100+ parts

-

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-

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713

$0.070

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-

-

Corohmni

South Africa . 60 parts In-Stock

1+ parts

$0.076

100+ parts

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60

$0.076

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Component Stockers USA

USA . 1,375,244 parts In-Stock

1+ parts

$0.080

100+ parts

$0.070

1k+ parts

$0.070

10k+ parts

$0.070

1,375,244

$0.080

$0.070

$0.070

$0.070

AZTECH Wire

Italy . 782 parts In-Stock

1+ parts

$18.670

100+ parts

-

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782

$18.670

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Continental Prestige Electronics

USA . 980,725 parts In-Stock

1+ parts

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$0.066

10k+ parts

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980,725

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$0.066

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Perfect Parts

USA . 7,876 parts In-Stock

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7,876

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Problanco Electronics

Mexico . 6,892 parts In-Stock

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TANS Electronics

Latvia . 5,138 parts In-Stock

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Kulean Microsystems

USA . 4,308 parts In-Stock

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SupplyDigital Components

Austria . 3,256 parts In-Stock

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3,256

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Kepictronics

USA . 1,525 parts In-Stock

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Assy Fe

Spain . 1,450 parts In-Stock

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GreenTree Electronics

Israel . 1,110 parts In-Stock

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Microchip USA

USA . 416 parts In-Stock

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416

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UHIMA Technologies

Türkiye . 178 parts In-Stock

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178

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Overview

Enhance your electronics projects with the NLU1G04AMX1TCG logic gate from Onsemi. Known for their high-quality components, Onsemi delivers reliability and performance that you can trust. This versatile logic gate is perfect for a wide range of applications, offering fast propagation delay and low power consumption. Whether you're a hobbyist or a professional, this product provides value and efficiency that will take your projects to the next level. Upgrade your circuits with Onsemi's NLU1G04AMX1TCG and experience the difference in quality and reliability.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast processing speed, making this product suitable for time-sensitive applications.

Surface Mount: YES

Easy installation and space-saving design for efficient circuit board layout.

Nominal Supply Voltage / Vsup: 3V

Compatible with common supply voltages and suitable for a wide range of applications.

Package Shape: RECTANGULAR

Standard package shape for easy handling and integration into existing circuits.

Load Capacitance (CL): 50 pF

Suitable for driving capacitive loads without sacrificing performance.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ideal for harsh environments.

Technology: CMOS

Low power consumption and high noise immunity for reliable performance.

Technical Specifications

Logic Gates NLU1G04AMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1G04AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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