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NL17SZU04P5T5G-L22088

Onsemi

NL17SZU04P5T5G-L22088 by Onsemi

NL17SZU04P5T5G-L22088 by Onsemi is a CMOS Logic Gate with 6.6ns Propagation Delay, 3V Nominal Voltage, and 50pF Load Capacitance. Ideal for industrial applications requiring fast signal processing in compact designs due to its small outline package and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,469 parts In-Stock

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Digiode

USA . 1,059 parts In-Stock

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Microchip USA

USA . 10,552 parts In-Stock

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$0.376

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$0.376

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AZTECH Wire

Italy . 834 parts In-Stock

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$20.510

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834

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QUARKTWIN TECHNOLOGY LTD

USA . 13,750 parts In-Stock

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13,750

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SupplyDigital Components

Austria . 6,946 parts In-Stock

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Problanco Electronics

Mexico . 6,394 parts In-Stock

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TANS Electronics

Latvia . 5,136 parts In-Stock

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Kulean Microsystems

USA . 1,053 parts In-Stock

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UHIMA Technologies

Türkiye . 991 parts In-Stock

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Corphita

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Corohmni

South Africa . 257 parts In-Stock

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Overview

Unlock the power of seamless logic functions with the NL17SZU04P5T5G-L22088 by Onsemi. Crafted with precision and expertise, this logic gate offers unparalleled performance and reliability. Ideal for a wide range of applications, this small outline package provides quick propagation delay and low power consumption. Experience the ease of integration and high-speed operation that this product brings, making it a valuable choice for your electronic projects. Choose Onsemi for quality, innovation, and cutting-edge technology in logic gates.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6.6 ns

Low propagation delay ensures fast operation and responsiveness of the logic gates, making them suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes these logic gates compatible with a wide range of electronic systems, providing flexibility in design.

Load Capacitance (CL): 50 pF

With a low load capacitance, these logic gates can drive capacitive loads effectively without compromising performance.

Technical Specifications

Logic Gates NL17SZU04P5T5G-L22088 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.6 ns

Propagation Delay (tpd):

12.1 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

NL17SZU04P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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