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NL17SZ125P5T5G-L22088

Onsemi

NL17SZ125P5T5G-L22088 by Onsemi

NL17SZ125P5T5G-L22088 by Onsemi is a 3-STATE bus driver with 6ns propagation delay, suitable for military applications. It operates at 3.3V with load capacitance of 50pF and max power supply current of 0.01mA. The package style is small outline, very thin profile, making it ideal for compact designs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,527 parts In-Stock

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8,527

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Digiode

USA . 344 parts In-Stock

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344

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Distributors (Availability)

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Microchip USA

USA . 9,531 parts In-Stock

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$0.390

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9,531

$0.390

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AZTECH Wire

Italy . 691 parts In-Stock

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$8.100

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691

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TANS Electronics

Latvia . 7,835 parts In-Stock

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SupplyDigital Components

Austria . 6,410 parts In-Stock

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Problanco Electronics

Mexico . 5,325 parts In-Stock

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Kulean Microsystems

USA . 1,806 parts In-Stock

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Corphita

USA . 1,004 parts In-Stock

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UHIMA Technologies

Türkiye . 990 parts In-Stock

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990

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Corohmni

South Africa . 413 parts In-Stock

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Overview

Enhance your electronic designs with the NL17SZ125P5T5G-L22088 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality products that guarantee reliability and performance. This bus driver & transceiver is versatile, making it ideal for a wide range of applications. Experience the value this product brings with its fast propagation delay, low power consumption, and small outline package style. Upgrade your projects with the NL17SZ125P5T5G-L22088 and unlock endless possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for long-term use in various environments.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast and efficient signal transmission, improving overall performance of the bus driver and transceiver.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on PCBs, saving space and simplifying assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most common electronic systems, offering versatility in application.

Load Capacitance (CL): 50 pF

The load capacitance of 50pF ensures stability and efficiency in signal transmission, minimizing distortion and improving signal integrity.

Power Supplies (V): 3.3

Operating at 3.3V power supply provides energy efficiency and compatibility with lower voltage systems, making it an economical choice for power consumption.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact and thin package design saves space on the PCB, allowing for more efficient layout and design of the electronic system.

Maximum I (ol): 24 Amp

High output current capability of 24A ensures reliable and robust performance, allowing the product to drive high-power bus systems effectively.

Output Characteristics: 3-STATE

3-STATE output allows for tri-state logic control, enabling efficient bus control and reduced power consumption when the output is in high impedance state.

Minimum Operating Temperature: -55 °C

Wide operating temperature range of -55 °C ensures reliable operation in harsh environments and extreme conditions, making it suitable for a variety of applications.

Technical Specifications

Bus Driver & Transceivers NL17SZ125P5T5G-L22088 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

17SZ

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

NL17SZ125P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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