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NL17SG126DFT2G

Onsemi

NL17SG126DFT2G by Onsemi

NL17SG126DFT2G by Onsemi is a 3-STATE bus driver with 19.6ns propagation delay, operating b/w -55 to 125 °C. With a supply voltage range of 0.9V to 3.6V, it's ideal for military-grade applications requiring small outline and thin profile packages in CMOS technology.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 104,649 parts In-Stock

1+ parts

$0.041

100+ parts

$0.038

1k+ parts

$0.034

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104,649

$0.041

$0.038

$0.034

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DigiKey

USA . 72,000 parts In-Stock

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$0.400

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$0.400

Flip Electronics (Authorized)

USA . 72,000 parts In-Stock

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72,000

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Digiode

USA . 768 parts In-Stock

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$0.039

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768

$0.039

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Vyrian

USA . 1,959 parts In-Stock

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$0.041

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$0.041

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Flip Electronics

USA . 72,000 parts In-Stock

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72,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 82,509 parts In-Stock

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$0.035

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$0.035

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Corphita

USA . 2,375 parts In-Stock

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$0.037

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2,375

$0.037

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Corohmni

South Africa . 141 parts In-Stock

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$0.041

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141

$0.041

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Vigor

Singapore . 250 parts In-Stock

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$0.090

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250

$0.090

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Kulean Microsystems

USA . 7,902 parts In-Stock

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TANS Electronics

Latvia . 4,168 parts In-Stock

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Microchip USA

USA . 4,039 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,515 parts In-Stock

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Problanco Electronics

Mexico . 328 parts In-Stock

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UHIMA Technologies

Türkiye . 90 parts In-Stock

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SupplyDigital Components

Austria . 65 parts In-Stock

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Overview

Enhance your electronic designs with the NL17SG126DFT2G by Onsemi, a top-tier manufacturer known for quality and reliability. This Bus Driver & Transceiver offers seamless communication and functionality for a wide range of applications. With a low nominal supply voltage of 3V and fast propagation delay of 19.6ns, this component ensures optimal performance in any project. Trust in the value and benefits that this product provides, from its small outline package to its true output polarity, making it a must-have for your next design challenge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making the product suitable for high-volume production.

Propagation Delay (tpd): 19.6 ns

Low propagation delay ensures fast signal transmission, making the product ideal for applications requiring high-speed data communication.

Temperature Grade: MILITARY

Military-grade temperature rating indicates that the product can withstand extreme temperature conditions, ensuring reliability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Technical Specifications

Bus Driver & Transceivers NL17SG126DFT2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

17SG

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

19.6 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SG126DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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