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NL17SH126P5T5G

Onsemi

NL17SH126P5T5G by Onsemi

NL17SH126P5T5G by Onsemi is a Bus Driver & Transceiver with 16ns propagation delay, 11.5ns tpd, and 50pF load capacitance. Ideal for military applications due to its CMOS technology, TRUE output polarity, and ENABLE HIGH control type.

Median Price

$0.054

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 307,371 parts In-Stock

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DigiKey

USA . 307,371 parts In-Stock

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$0.050

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$0.050

Rochester

USA . 301,871 parts In-Stock

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$0.062

1k+ parts

$0.051

10k+ parts

$0.046

301,871

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$0.062

$0.051

$0.046

Verical

USA . 203,996 parts In-Stock

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$0.058

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Digiode

USA . 217 parts In-Stock

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$0.048

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Vyrian

USA . 1,722 parts In-Stock

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Corphita

USA . 1,430 parts In-Stock

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Corohmni

South Africa . 317 parts In-Stock

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Vigor

Singapore . 235 parts In-Stock

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Continental Prestige Electronics

USA . 307,371 parts In-Stock

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$0.044

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Problanco Electronics

Mexico . 6,653 parts In-Stock

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TANS Electronics

Latvia . 6,601 parts In-Stock

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Kulean Microsystems

USA . 5,034 parts In-Stock

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SupplyDigital Components

Austria . 1,388 parts In-Stock

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UHIMA Technologies

Türkiye . 404 parts In-Stock

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Microchip USA

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Overview

Experience unmatched reliability and performance with the NL17SH126P5T5G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Bus Driver & Transceivers that are perfect for a wide range of applications. With a fast propagation delay and 3-STATE output characteristics, this product ensures seamless operation. The small outline package, dual terminal position, and true output polarity make installation a breeze. Trust Onsemi to provide a product that exceeds expectations and offers excellent value to customers looking for high-quality components.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 16 ns

Low propagation delay ensures fast data transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape provides a stable and secure mounting option, ensuring reliability in various operating conditions.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with common power supplies and systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures efficient signal transmission and reception, maintaining signal integrity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the product to function reliably in various environments, including harsh industrial settings.

Output Characteristics: 3-STATE

3-STATE output feature enables the device to have high impedance output, allowing multiple drivers to share a common bus line without interference.

Technical Specifications

Bus Driver & Transceivers NL17SH126P5T5G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-XDSO-F5

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

FL6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.8 mm

Trade Compliance

NL17SH126P5T5G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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