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NL17SZ125DBVT1G

Onsemi

NL17SZ125DBVT1G by Onsemi

NL17SZ125DBVT1G by Onsemi is a 3-STATE bus driver with 6ns propagation delay, suitable for military applications. It operates at a voltage range of 1.65V to 5.5V and has a load capacitance of 50pF, making it ideal for high-speed data transmission in compact electronic devices. With a small outline package style and dual terminal position, this TTL technology device offers reliable performance in harsh environments with temperatures ranging from -55°C to 125°C.

Median Price

$0.078

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 35,524 parts In-Stock

1+ parts

$0.100

100+ parts

$0.036

1k+ parts

$0.029

10k+ parts

$0.025

35,524

$0.100

$0.036

$0.029

$0.025

Mouser Electronics

USA . 8,784 parts In-Stock

1+ parts

$0.100

100+ parts

$0.036

1k+ parts

$0.029

10k+ parts

$0.026

8,784

$0.100

$0.036

$0.029

$0.026

Rochester

USA . 620,900 parts In-Stock

1+ parts

-

100+ parts

$0.056

1k+ parts

$0.047

10k+ parts

$0.042

620,900

-

$0.056

$0.047

$0.042

Verical

USA . 482,900 parts In-Stock

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-

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$0.052

482,900

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$0.052

EBV Elektronik

Germany . 300,000 parts In-Stock

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Avnet

USA . 72,000 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 905 parts In-Stock

1+ parts

$0.024

100+ parts

-

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905

$0.024

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.027

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10

$0.027

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Vyrian

USA . 443,663 parts In-Stock

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443,663

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NAC Semi

USA . 240,000 parts In-Stock

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$0.120

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$0.120

Flip Electronics

USA . 111,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 37,121 parts In-Stock

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Velocity Electronics

USA . 9,699 parts In-Stock

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9,699

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Distributors (Availability)

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Ampacity Inc.

Singapore . 284,609 parts In-Stock

1+ parts

$0.021

100+ parts

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284,609

$0.021

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Corphita

USA . 1,646 parts In-Stock

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$0.022

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1,646

$0.022

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Aranea Global

USA . 1,000 parts In-Stock

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$0.026

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$0.025

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1,000

$0.026

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$0.025

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Argo Parts USA

USA . 3,425 parts In-Stock

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$0.027

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$0.026

3,425

$0.027

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$0.026

Continental Prestige Electronics

USA . 3,156 parts In-Stock

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$0.027

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$0.026

3,156

$0.027

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$0.026

Corohmni

South Africa . 493 parts In-Stock

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$0.038

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493

$0.038

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Microchip USA

USA . 11,307 parts In-Stock

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TANS Electronics

Latvia . 6,337 parts In-Stock

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Lixinc

USA . 6,298 parts In-Stock

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Perfect Parts

USA . 6,160 parts In-Stock

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SupplyDigital Components

Austria . 6,131 parts In-Stock

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Kulean Microsystems

USA . 3,718 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,454 parts In-Stock

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Problanco Electronics

Mexico . 284 parts In-Stock

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UHIMA Technologies

Türkiye . 166 parts In-Stock

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Vigor

Singapore . 142 parts In-Stock

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Overview

Enhance your electronic designs with the NL17SZ125DBVT1G by Onsemi. Crafted with precision and expertise, Onsemi delivers top-quality Bus Driver & Transceivers that guarantee reliability and performance. Ideal for a wide range of applications, this product offers fast propagation delay, low power consumption, and 3-state output characteristics. With a compact design and military-grade temperature grade, the NL17SZ125DBVT1G provides exceptional value and versatility to customers looking for cutting-edge solutions in their projects. Elevate your electronics with Onsemi's innovative technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for a bus driver application where weight and durability are important factors.

Propagation Delay At Nominal Supply: 6 ns

With a low propagation delay, this product ensures fast and efficient signal transmission, making it ideal for high-speed bus communication systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of this product on circuit boards, making it a practical choice for compact bus driver designs.

Package Shape: RECTANGULAR

The rectangular package shape provides a space-efficient design for this product, making it suitable for applications with limited board space.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3V is well-suited for bus driver applications, providing a stable power source for reliable operation.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures effective signal transmission and reception, making this product a reliable choice for bus communication systems.

No. of Terminals: 5

With 5 terminals, this product offers versatility in connectivity options, making it suitable for various bus driver configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this product compact and space-saving, perfect for applications with limited board space.

Technical Specifications

Bus Driver & Transceivers NL17SZ125DBVT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

17SZ

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NL17SZ125DBVT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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