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NL17SG373DFT2G

Onsemi

NL17SG373DFT2G by Onsemi

NL17SG373DFT2G by Onsemi is a Bus Driver & Transceiver with 21.2 ns propagation delay, 3-STATE output characteristics, and 1.1 mm max seated height. It operates at temperatures ranging from -55 to 125 °C and has a supply voltage of 3V. Ideal for military-grade applications requiring compact design and fast signal transmission.

Median Price

$0.464

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,330 parts In-Stock

1+ parts

$1.040

100+ parts

$0.597

1k+ parts

$0.516

10k+ parts

-

1,330

$1.040

$0.597

$0.516

-

Farnell

UK . 119,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.584

119,800

-

-

-

$0.584

Rochester

USA . 104,822 parts In-Stock

1+ parts

-

100+ parts

$0.061

1k+ parts

$0.051

10k+ parts

$0.045

104,822

-

$0.061

$0.051

$0.045

Verical

USA . 83,800 parts In-Stock

1+ parts

-

100+ parts

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$0.056

83,800

-

-

-

$0.056

Flip Electronics (Authorized)

USA . 78,000 parts In-Stock

1+ parts

-

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78,000

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Mouser Electronics

USA . 251 parts In-Stock

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-

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$0.464

251

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$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 642 parts In-Stock

1+ parts

$0.048

100+ parts

-

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642

$0.048

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-

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Vyrian

USA . 550 parts In-Stock

1+ parts

$0.050

100+ parts

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550

$0.050

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Flip Electronics

USA . 78,000 parts In-Stock

1+ parts

-

100+ parts

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78,000

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NAC Semi

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

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$0.076

12,000

-

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-

$0.076

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 62,363 parts In-Stock

1+ parts

$0.043

100+ parts

-

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62,363

$0.043

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Corphita

USA . 231 parts In-Stock

1+ parts

$0.045

100+ parts

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231

$0.045

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Corohmni

South Africa . 152 parts In-Stock

1+ parts

$0.050

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152

$0.050

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Vigor

Singapore . 176 parts In-Stock

1+ parts

$0.660

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176

$0.660

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Microchip USA

USA . 5,148 parts In-Stock

1+ parts

$3.387

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5,148

$3.387

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Modulus Dynamics

Lithuania . 3,477 parts In-Stock

1+ parts

$15.796

100+ parts

$15.796

1k+ parts

$15.796

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3,477

$15.796

$15.796

$15.796

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Continental Prestige Electronics

USA . 101,800 parts In-Stock

1+ parts

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100+ parts

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$0.462

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101,800

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$0.462

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Eastek

USA . 15,000 parts In-Stock

1+ parts

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$0.070

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15,000

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$0.070

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Lixinc

USA . 14,074 parts In-Stock

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14,074

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TANS Electronics

Latvia . 5,563 parts In-Stock

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5,563

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Kulean Microsystems

USA . 3,946 parts In-Stock

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3,946

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SupplyDigital Components

Austria . 3,864 parts In-Stock

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Problanco Electronics

Mexico . 2,699 parts In-Stock

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2,699

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Aranea Global

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 915 parts In-Stock

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915

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Argo Parts USA

USA . 381 parts In-Stock

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381

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Overview

Experience seamless data transmission with the NL17SG373DFT2G by Onsemi, a top-of-the-line Bus Driver & Transceiver. Crafted from high-quality materials and boasting a compact design, this product ensures reliable performance in a variety of applications. With a fast propagation delay, low power consumption, and wide operating temperature range, customers can trust in the value and efficiency that this component brings to their projects. Upgrade your systems today with the NL17SG373DFT2G for unparalleled connectivity and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and impact resistance, making it suitable for rugged environments commonly found in bus driver applications.

Propagation Delay At Nominal Supply: 21.2 ns

Low propagation delay ensures fast and efficient data transmission, crucial for timely communication between bus systems.

Surface Mount: YES

Surface mount capability makes installation easy and saves space, ideal for compact bus driver designs.

Nominal Supply Voltage / Vsup (V): 3

Operates at a common supply voltage of 3V, compatible with standard bus power systems.

Load Capacitance (CL): 30 pF

Optimized load capacitance for stable operation and signal integrity in bus communication.

Power Supplies (V): 1.2/3.3

Supports multiple power supply options, offering flexibility in bus driver integration.

No. of Terminals: 6

Sufficient number of terminals for connecting to bus systems and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design with a thin profile and shrink pitch saves space and allows for high-density mounting on bus driver boards.

Maximum I (ol): 0.3 Amp

High output current capability for driving bus loads effectively.

Propagation Delay (tpd): 21.2 ns

Consistent propagation delay ensures reliable and synchronized data transmission in bus networks.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for bus driver applications exposed to varying environmental conditions.

Output Characteristics: 3-STATE

3-STATE output allows for tri-state bus signaling, enabling a high level of control and flexibility in bus communication.

Minimum Operating Temperature: -55 °C

Ability to operate in low-temperature conditions common in automotive and industrial bus systems.

Terminal Finish: MATTE TIN

Matte tin finish for reliable solder connections and improved conductivity.

Terminal Position: DUAL

Dual terminal position for secure and stable connections in bus driver circuits.

No. of Ports: 2

Two ports for establishing connections to multiple bus lines or systems.

Maximum Seated Height: 1.1 mm

Low-profile design with maximum seated height for compact bus driver assemblies.

Width: 1.25 mm

Narrow width for space-saving integration in bus driver applications with limited board space.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission in bus communication.

Minimum Supply Voltage (Vsup): 0.9 V

Low minimum supply voltage allows for efficient power usage in bus driver systems.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for lead-free soldering processes in bus driver manufacturing.

Length: 2 mm

Compact length for space-efficient placement on bus driver PCBs.

Temperature Grade: MILITARY

Military-grade temperature rating for reliable performance in harsh operating conditions typically encountered in bus driver systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, essential for efficient bus driver operation.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and mechanical stability in bus driver assemblies.

Packing Method: TR

Tray packaging method for convenient transportation and storage of bus driver components.

Terminal Pitch: 0.65 mm

Optimal terminal pitch for easy mounting and connections in bus driver circuits.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance for reliable operation and protection against overvoltage conditions in bus driver systems.

Technical Specifications

Bus Driver & Transceivers NL17SG373DFT2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

17SG

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

.3 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.2 ns

Propagation Delay (tpd):

21.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SG373DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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