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NL17SG125CMUTCG

Onsemi

NL17SG125CMUTCG by Onsemi

NL17SG125CMUTCG by Onsemi is a CMOS bus driver with 17.5 ns propagation delay, 3-STATE output, and 30 pF load capacitance. Ideal for military applications due to its small outline package and dual terminal position, operating b/w -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,984 parts In-Stock

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Digiode

USA . 1,310 parts In-Stock

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SupplyDigital Components

Austria . 6,950 parts In-Stock

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TANS Electronics

Latvia . 4,424 parts In-Stock

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Kulean Microsystems

USA . 2,049 parts In-Stock

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Corphita

USA . 979 parts In-Stock

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Problanco Electronics

Mexico . 555 parts In-Stock

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Corohmni

South Africa . 306 parts In-Stock

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UHIMA Technologies

Türkiye . 50 parts In-Stock

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Overview

Discover the Onsemi NL17SG125CMUTCG, a high-quality bus driver & transceiver that offers unparalleled performance and reliability. Manufactured by Onsemi, this product is designed to meet the demands of various applications with its advanced technology and durable construction. From its 3-STATE output characteristics to its TRUE output polarity, this device provides exceptional value and benefits to customers looking for a compact and efficient solution. With a wide operating temperature range and low power consumption, the NL17SG125CMUTCG is the ideal choice for your next project. Upgrade your system today with Onsemi's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for harsh operating environments.

Propagation Delay At Nominal Supply: 17.5 ns

Low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

Nominal supply voltage of 3V is commonly used in many electronic systems, ensuring compatibility with a wide range of applications.

Load Capacitance (CL): 30 pF

Efficiently handles a load capacitance of 30 pF, making the product suitable for driving capacitive loads without signal degradation.

Power Supplies (V): 1.2/3.3

Supports multiple power supply options (1.2V and 3.3V), providing flexibility and compatibility with different power configurations.

No. of Terminals: 6

Six terminals provide ample connectivity options for interfacing with other components, enhancing the product's versatility.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact and thin package style saves space on the PCB, making it ideal for applications where size constraints are a concern.

Maximum I (ol): 0.3 Amp

High output current capability of 0.3A allows the product to drive external loads with sufficient power, ensuring reliable signal transmission.

Propagation Delay (tpd): 19.6 ns

Low propagation delay of 19.6 ns ensures minimal signal delay, enabling fast and efficient data transmission in time-critical applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of -55 °C to 125°C allows the product to perform reliably in extreme environmental conditions, enhancing its durability.

Output Characteristics: 3-STATE

3-STATE output allows the product to drive bus lines or transceivers where multiple devices can share the same communication channel without interference.

Minimum Operating Temperature: -55 °C

Capable of operating at temperatures as low as -55 °C, making it suitable for use in cold environments or applications that require extended temperature range support.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel Gold Palladium terminal finish provides excellent corrosion resistance and solderability, ensuring long-term reliability and robust performance.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout options and simplifies the connection of external components, making installation and design easier.

No. of Ports: 2

Two ports provide multiple connection points for interfacing with other devices or systems, enhancing the product's versatility and compatibility.

Maximum Seated Height: 0.55 mm

Low maximum seated height of 0.55mm reduces the overall profile of the product, making it suitable for space-constrained applications or compact designs.

Width: 1 mm

Slim width of 1mm enables efficient use of space on the PCB, allowing for more compact and streamlined circuit designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and reception, reducing the risk of errors or signal misinterpretation in communication systems.

Minimum Supply Voltage (Vsup): 0.9 V

Low minimum supply voltage of 0.9V allows the product to operate efficiently even with low power sources, enhancing energy efficiency and flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

Capability to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering during assembly, improving overall product reliability and performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures proper soldering of the product on the PCB, preventing solder joint failure and maintaining long-term reliability.

Length: 1 mm

Compact length of 1mm allows for efficient use of space on the PCB, enabling compact and space-saving circuit designs.

Temperature Grade: MILITARY

Military-grade temperature rating ensures high reliability and performance in harsh environmental conditions, making the product suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation, making the product energy-efficient and reliable for various applications.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination, offering environmental friendliness and compliance with RoHS regulations.

Packing Method: TR

TR (Tape and Reel) packing method provides convenience in handling, transportation, and automated assembly processes, improving productivity and cost-effectiveness.

Terminal Pitch: 0.35 mm

Fine terminal pitch of 0.35mm allows for high-density PCB layouts, enabling compact and space-efficient designs for modern electronic devices.

Control Type: ENABLE LOW

Enable Low control type ensures easy interfacing with control signals and devices, facilitating seamless integration into existing systems or designs.

Maximum Supply Voltage (Vsup): 3.6 V

Maximum supply voltage of 3.6V provides a safety margin for voltage fluctuations or transient events, ensuring stable and reliable operation of the product.

Technical Specifications

Bus Driver & Transceivers NL17SG125CMUTCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

17SG

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

.3 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

17.5 ns

Propagation Delay (tpd):

19.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL17SG125CMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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