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NL17SZ125DFT2

Onsemi

NL17SZ125DFT2 by Onsemi

NL17SZ125DFT2 by Onsemi is a 3-STATE bus driver with 6ns propagation delay, operating at -40 to 125 °C. It has a supply voltage of 1.8V, load capacitance of 50pF, and can handle up to 24A current. Ideal for automotive applications due to its small size (2x1.25mm) and TTL technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 212,500 parts In-Stock

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Vyrian

USA . 5,846 parts In-Stock

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NPI Materials, Inc.

USA . 2,790 parts In-Stock

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Semi Source

USA . 2,785 parts In-Stock

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J2 Sourcing AB

Sweden . 2,551 parts In-Stock

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Digiode

USA . 2,482 parts In-Stock

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R&J Components

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Vigor

Singapore . 680 parts In-Stock

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$0.050

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680

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AZTECH Wire

Italy . 378 parts In-Stock

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$10.900

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Ampacity Inc.

Singapore . 1,333 parts In-Stock

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$40.000

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Component Stockers USA

USA . 392 parts In-Stock

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$99.990

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Perfect Parts

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Problanco Electronics

Mexico . 5,925 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,171 parts In-Stock

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TANS Electronics

Latvia . 4,591 parts In-Stock

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Kulean Microsystems

USA . 3,928 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 1,398 parts In-Stock

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Corohmni

South Africa . 418 parts In-Stock

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UHIMA Technologies

Türkiye . 295 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the NL17SZ125DFT2 by Onsemi - a cutting-edge Bus Driver & Transceivers component that boasts top-notch quality and reliability. Manufactured by Onsemi, a renowned industry leader, this product offers exceptional performance and precision in a wide range of applications. With its compact size and efficient design, the NL17SZ125DFT2 provides customers with unparalleled value, seamless integration, and enhanced functionality. Elevate your projects with this innovative solution and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making it a reliable choice for bus driver & transceivers.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast and efficient signal transmission in the bus driver & transceiver, leading to better performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing overall manufacturing costs.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement of 1.8V ensures energy efficiency and compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance of 50pF helps in maintaining signal integrity and reducing noise in the communication system.

Power Supplies (V): 3.3

Operating at 3.3V power supply ensures compatibility with standard voltage levels in most applications, making it a versatile option.

Maximum I (ol): 24 Amp

High output current of 24A ensures the bus driver & transceiver can drive high loads with ease, making it suitable for a variety of applications.

Output Characteristics: 3-STATE

3-state output allows for high flexibility in controlling the output signals, enabling efficient operation in multi-driver bus systems.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range (-40 °C to 125°C) ensures reliability in harsh environments, making it suitable for automotive applications.

Technology: TTL

TTL technology provides high-speed operation and compatibility with TTL logic levels, ensuring reliable data transmission in the bus driver & transceiver.

Technical Specifications

Bus Driver & Transceivers NL17SZ125DFT2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NL17SZ125DFT2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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