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NL17SG126CMUTCG

Onsemi

NL17SG126CMUTCG by Onsemi

NL17SG126CMUTCG by Onsemi is a CMOS bus driver with 6 terminals, operating b/w -55 to 125 °C. It has a propagation delay of 19.6 ns and supports a supply voltage range from 0.9V to 3.6V. Ideal for military-grade applications requiring true output polarity and dual terminal position in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,378 parts In-Stock

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Digiode

USA . 443 parts In-Stock

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SupplyDigital Components

Austria . 7,328 parts In-Stock

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Kulean Microsystems

USA . 5,031 parts In-Stock

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TANS Electronics

Latvia . 4,111 parts In-Stock

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Problanco Electronics

Mexico . 3,034 parts In-Stock

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Corphita

USA . 964 parts In-Stock

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UHIMA Technologies

Türkiye . 952 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the NL17SG126CMUTCG Bus Driver & Transceivers. With a military-grade temperature grade and advanced CMOS technology, this product offers unmatched performance in various applications. Its compact design and true output polarity make it ideal for demanding environments. Trust Onsemi to deliver innovative solutions that exceed your expectations and elevate your projects to new heights. Elevate your designs with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making it a practical choice for a bus driver and transceiver.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on printed circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of devices and systems.

Propagation Delay (tpd): 19.6 ns

With a low propagation delay, this product can quickly transmit signals, resulting in efficient communication within the system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature provides the product with reliability and stability in various environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for flexibility in signal control, enhancing the product's functionality and versatility.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making it a suitable choice for this product.

Technical Specifications

Bus Driver & Transceivers NL17SG126CMUTCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

17SG

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

19.6 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL17SG126CMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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