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NL17SZ125MU3TCG

Onsemi

NL17SZ125MU3TCG by Onsemi

NL17SZ125MU3TCG by Onsemi is a 6-terminal bus driver with 10.5ns propagation delay, suitable for military applications. It operates at -55 to 125 °C and has a max supply voltage of 5.5V, making it ideal for TTL technology in harsh environments. The package is small outline with very thin profile, featuring surface mount capability and true output polarity.

Median Price

$0.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,866 parts In-Stock

1+ parts

$0.520

100+ parts

$0.196

1k+ parts

$0.127

10k+ parts

$0.082

2,866

$0.520

$0.196

$0.127

$0.082

Rochester

USA . 182,850 parts In-Stock

1+ parts

-

100+ parts

$0.103

1k+ parts

$0.085

10k+ parts

$0.076

182,850

-

$0.103

$0.085

$0.076

Verical

USA . 9,000 parts In-Stock

1+ parts

-

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$0.058

9,000

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$0.058

Arrow

USA . 9,000 parts In-Stock

1+ parts

-

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$0.058

9,000

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-

$0.058

Distributors (In-Stock)

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Digiode

USA . 1,155 parts In-Stock

1+ parts

$0.080

100+ parts

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1,155

$0.080

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Flip Electronics

USA . 144,000 parts In-Stock

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144,000

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Vyrian

USA . 3,746 parts In-Stock

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3,746

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Distributors (Availability)

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Corohmni

South Africa . 302 parts In-Stock

1+ parts

$0.021

100+ parts

-

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302

$0.021

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Corphita

USA . 1,668 parts In-Stock

1+ parts

$0.076

100+ parts

-

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1,668

$0.076

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AZTECH Wire

Italy . 79 parts In-Stock

1+ parts

$10.960

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79

$10.960

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Problanco Electronics

Mexico . 8,022 parts In-Stock

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SupplyDigital Components

Austria . 4,988 parts In-Stock

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Kulean Microsystems

USA . 4,160 parts In-Stock

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4,160

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TANS Electronics

Latvia . 2,008 parts In-Stock

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2,008

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UHIMA Technologies

Türkiye . 479 parts In-Stock

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479

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Microchip USA

USA . 417 parts In-Stock

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417

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Overview

Enhance your electronic designs with the NL17SZ125MU3TCG by Onsemi. Known for their top-quality manufacturing, Onsemi delivers reliable bus drivers and transceivers that are essential for various applications. This compact and versatile component offers a quick propagation delay of 6ns, true output polarity, and a wide operating temperature range from -55 °C to 125°C. With a small outline and very thin profile package style, this product is perfect for military-grade projects where space is limited. Experience the value and benefits this high-performance device brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protects the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3V makes the bus driver & transceiver compatible with a wide range of electronic devices.

Output Characteristics: 3-STATE

3-STATE output characteristics allow the bus driver & transceiver to control multiple buses effectively, enhancing flexibility in signal routing.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable performance in harsh environmental conditions, making this product ideal for industrial and military applications.

Technical Specifications

Bus Driver & Transceivers NL17SZ125MU3TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

17SZ

JESD-30 Code:

S-PDSO-G6

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Maximum Seated Height:

.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL17SZ125MU3TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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