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NL17SG14AMUTCG

Onsemi

NL17SG14AMUTCG by Onsemi

NL17SG14AMUTCG by Onsemi is a CMOS Logic Gate with 58.1ns Propagation Delay, operating b/w -55 to 125 °C. It has 6 terminals, a supply voltage range of 0.9-3.6V, and is MILITARY grade suitable for various applications requiring fast signal processing in compact spaces.

Median Price

$0.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 93,000 parts In-Stock

1+ parts

-

100+ parts

$0.145

1k+ parts

$0.121

10k+ parts

$0.107

93,000

-

$0.145

$0.121

$0.107

Verical

USA . 93,000 parts In-Stock

1+ parts

-

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$0.134

93,000

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$0.134

Distributors (In-Stock)

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Digiode

USA . 695 parts In-Stock

1+ parts

$0.113

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695

$0.113

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Vyrian

USA . 3,841 parts In-Stock

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3,841

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Distributors (Availability)

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Corphita

USA . 257 parts In-Stock

1+ parts

$0.107

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257

$0.107

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Corohmni

South Africa . 337 parts In-Stock

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$0.119

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337

$0.119

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AZTECH Wire

Italy . 787 parts In-Stock

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$11.130

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787

$11.130

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TANS Electronics

Latvia . 6,734 parts In-Stock

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6,734

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SupplyDigital Components

Austria . 6,030 parts In-Stock

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Problanco Electronics

Mexico . 3,989 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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UHIMA Technologies

Türkiye . 805 parts In-Stock

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805

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Microchip USA

USA . 497 parts In-Stock

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Kulean Microsystems

USA . 107 parts In-Stock

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107

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Overview

Discover the cutting-edge NL17SG14AMUTCG by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This logic gate, ideal for military-grade applications, offers customers unmatched precision and efficiency. With a small outline and very thin profile, this product is perfect for space-constrained projects. Benefit from quick propagation delay, dual terminal position, and a wide operating temperature range. Elevate your projects with the NL17SG14AMUTCG and experience unparalleled performance and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying assembly.

Propagation Delay (tpd): 58.1 ns

Fast propagation delay enables quick signal processing, suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency.

Technical Specifications

Logic Gates NL17SG14AMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SG

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

58.1 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL17SG14AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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