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NGB15N41ACLT4G

Onsemi

NGB15N41ACLT4G by Onsemi

NGB15N41ACLT4G by Onsemi is an N-CHANNEL IGBT with 440V VCE, 15A IC, and 107W power dissipation. Ideal for applications requiring high power switching such as motor drives, inverters, and industrial equipment due to its fast rise time of 7000ns and fall time of 15000ns. It operates at a max temperature of 175 °C and features surface mount packaging.

Median Price

$0.728

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Rochester

USA . 399 parts In-Stock

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$0.728

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$0.684

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$0.619

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399

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$0.619

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Avnet

USA . 399 parts In-Stock

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399

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Digiode

USA . 1,024 parts In-Stock

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$0.692

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Vyrian

USA . 4,315 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 575 parts In-Stock

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Bristol Electronics

USA . 575 parts In-Stock

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Dan-Mar Components

USA . 575 parts In-Stock

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Ampacity Inc.

Singapore . 9 parts In-Stock

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$0.620

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Corphita

USA . 2,400 parts In-Stock

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$0.655

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Component Stockers USA

USA . 508 parts In-Stock

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$0.710

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$0.670

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Corohmni

South Africa . 494 parts In-Stock

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Microchip USA

USA . 2,849 parts In-Stock

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$4.355

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Problanco Electronics

Mexico . 6,908 parts In-Stock

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Kulean Microsystems

USA . 6,720 parts In-Stock

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SupplyDigital Components

Austria . 5,636 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,844 parts In-Stock

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Kepictronics

USA . 1,600 parts In-Stock

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TANS Electronics

Latvia . 1,546 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 912 parts In-Stock

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Futuretech Components

Singapore . 658 parts In-Stock

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Overview

Elevate your electronic devices with the NGB15N41ACLT4G by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor (IGBT) that guarantees superior performance and reliability. Onsemi's reputation for high-quality components shines through in this N-channel IGBT, which is designed to meet the demands of various applications. Let your products stand out with the advanced features of this surface-mount device, offering customers unmatched value, efficiency, and durability. Upgrade your creations with the NGB15N41ACLT4G and experience the difference that Onsemi can make in your designs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs offer lower conduction losses and higher efficiency compared to P-CHANNEL, making it a good choice for high power applications.

Surface Mount: YES

Surface mount IGBTs are easy to install and suitable for automated assembly processes, saving time and effort during production.

Maximum Rise Time (tr): 7000 ns

The fast rise time of 7000 ns ensures quick switching speeds, reducing power loss and improving overall efficiency of the circuit.

Maximum Fall Time (tf): 15000 ns

The high fall time of 15000 ns allows for proper turn-off characteristics, preventing current overload and enhancing the reliability of the IGBT.

Maximum Power Dissipation (Abs): 107 W

With a high power dissipation of 107 W, this IGBT can handle significant power levels without overheating, making it suitable for demanding applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures stable performance even in harsh environments, providing reliable operation under extreme conditions.

Maximum Collector-Emitter Voltage: 440 V

The high maximum collector-emitter voltage of 440 V allows for handling of high voltage loads, making it suitable for power electronics applications.

Maximum Gate-Emitter Voltage: 15 V

The maximum gate-emitter voltage of 15 V ensures safe and reliable operation of the IGBT, protecting it from damage due to overvoltage.

Maximum Collector Current (IC): 15 A

With a maximum collector current of 15 A, this IGBT can handle high current loads, making it suitable for power switching applications.

Maximum Gate-Emitter Threshold Voltage: 1.9 V

The low gate-emitter threshold voltage of 1.9 V ensures efficient gate control, enabling precise switching and minimizing power losses in the circuit.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGB15N41ACLT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

440 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

1.9 V

Maximum Gate-Emitter Voltage:

15 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

NGB15N41ACLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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