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NCV7420D26G

Onsemi

NCV7420D26G by Onsemi

NCV7420D26G by Onsemi is a Line Transceiver IC with 14 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 6-26V and is suitable for automotive applications due to its small outline package and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 22,000 parts In-Stock

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Vyrian

USA . 4,425 parts In-Stock

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Digiode

USA . 1,298 parts In-Stock

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Advanced Electronics

New Zealand . 91 parts In-Stock

1+ parts

$7.997

100+ parts

$7.277

1k+ parts

$6.558

10k+ parts

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91

$7.997

$7.277

$6.558

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AZTECH Wire

Italy . 298 parts In-Stock

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$9.460

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298

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SupplyDigital Components

Austria . 6,593 parts In-Stock

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Problanco Electronics

Mexico . 5,424 parts In-Stock

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Kulean Microsystems

USA . 3,502 parts In-Stock

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Vigor

Singapore . 753 parts In-Stock

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Corphita

USA . 469 parts In-Stock

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Corohmni

South Africa . 399 parts In-Stock

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399

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TANS Electronics

Latvia . 352 parts In-Stock

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UHIMA Technologies

Türkiye . 285 parts In-Stock

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285

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Microchip USA

USA . 229 parts In-Stock

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Overview

Enhance your automotive electronics with the NCV7420D26G by Onsemi. With a high-quality construction and top-notch performance, this line transceiver offers unparalleled reliability and efficiency. Designed for a wide range of applications, this product is a must-have for those looking for seamless communication in their automotive systems. Trust Onsemi's expertise and innovation to provide you with a solution that delivers value, benefits, and advantages like no other. Elevate your electronics with the NCV7420D26G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection for the components inside, making this product reliable for long-term use.

Surface Mount: YES

Being surface mountable means easy and convenient installation on circuit boards, saving time and effort for assembly.

Maximum Supply Voltage: 26 V

Support for a high maximum supply voltage allows for flexibility in different applications, accommodating a wide range of power requirements.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient, making it easy to fit into compact designs and saving valuable board space.

No. of Terminals: 14

With 14 terminals, this product offers multiple connection points for interfacing with other components, providing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the product's overall compactness and efficiency, ideal for applications where space is limited.

Minimum Supply Voltage: 6 V

A low minimum supply voltage requirement allows for operation in systems with limited power availability, increasing the product's flexibility in various environments.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability in extreme conditions, making this product suitable for industrial or automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature rating enables the product to function effectively in cold environments, expanding its range of potential uses.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and conductivity, ensuring reliable signal transmission and longevity of the product.

Terminal Position: DUAL

Dual terminal position enhances the product's connectivity and compatibility with different circuit configurations, offering versatility in system integration.

Maximum Seated Height: 1.72 mm

Low maximum seated height allows for a slim profile, making this product suitable for applications with height restrictions or where space is a concern.

Width: 3.93 mm

Compact width dimension adds to the product's space-saving design, enabling easy integration into tight spaces and enhancing overall system layout efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly, contributing to the product's overall reliability and performance.

Peak Reflow Temperature °C: 260

Support for a high peak reflow temperature of 260 °C indicates robust construction and compatibility with standard reflow soldering processes, ensuring hassle-free assembly.

Length: 8.68 mm

Optimal length dimension contributes to the product's compact form factor, making it easy to incorporate into various electronic devices and systems.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification indicates that this product meets stringent quality standards for automotive applications, ensuring reliable performance in demanding environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure electrical connections and mechanical stability, enhancing the product's overall durability and longevity.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with common interface standards, facilitating seamless integration with other components and devices.

Nominal Supply Voltage: 7.3 V

A nominal supply voltage of 7.3V offers a balanced power requirement for efficient operation, ensuring optimal performance in a wide range of applications.

Terminal Pitch: 1.27 mm

The narrow terminal pitch enhances connectivity options and facilitates precise PCB layout, allowing for dense packing and efficient use of board space.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this product has moderate moisture sensitivity, making it suitable for various storage and handling conditions without compromising performance.

Interface IC Type: LINE TRANSCEIVER

Featuring a line transceiver interface IC type, this product offers reliable signal transmission and reception capabilities, making it a versatile choice for communication applications.

Technical Specifications

Line Drivers & Receivers NCV7420D26G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.68 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Receiver No. of Bits:

1

Maximum Seated Height:

1.72 mm

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

7.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.93 mm

Trade Compliance

NCV7420D26G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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