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NCV7321D10G

Onsemi

NCV7321D10G by Onsemi

NCV7321D10G by Onsemi is a Line Transceiver IC with 8 terminals, operating at -40 to 125 °C. It features a supply voltage range of 5-27V and max receive delay of 6000ns. Ideal for automotive applications due to its Schmitt Trigger input characteristics and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 39,000 parts In-Stock

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39,000

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Vyrian

USA . 13,079 parts In-Stock

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Digiode

USA . 455 parts In-Stock

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455

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AZTECH Wire

Italy . 1,196 parts In-Stock

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$8.140

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Problanco Electronics

Mexico . 7,562 parts In-Stock

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SupplyDigital Components

Austria . 3,860 parts In-Stock

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Corphita

USA . 1,344 parts In-Stock

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Vigor

Singapore . 977 parts In-Stock

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TANS Electronics

Latvia . 934 parts In-Stock

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Kulean Microsystems

USA . 682 parts In-Stock

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UHIMA Technologies

Türkiye . 680 parts In-Stock

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680

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Futuretech Components

Singapore . 673 parts In-Stock

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Corohmni

South Africa . 463 parts In-Stock

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Perfect Parts

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Microchip USA

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Overview

Onsemi's NCV7321D10G is the ultimate solution for all your Line Drivers & Receivers needs. With a maximum supply voltage of 27V and a temperature grade of automotive, this product offers unmatched reliability and performance. Its small outline package shape and dual terminal position make it ideal for a wide range of applications. Trust in Onsemi's reputation for quality and innovation, and experience the value and benefits that the NCV7321D10G brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to harsh environmental conditions, making this product long-lasting and reliable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and enabling mass production.

Maximum Supply Voltage: 27 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and easy to integrate into circuit designs, enhancing the overall functionality of the product.

No. of Terminals: 8

Having 8 terminals allows for multiple connection options and increased flexibility in circuit configurations, making it suitable for complex setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards, making it ideal for compact electronic devices or densely populated PCBs.

Minimum Supply Voltage: 5 V

The low minimum supply voltage requirement enables efficient power consumption and operation, making this product energy-efficient.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable performance even in extreme heat conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows for reliable performance in cold environments, making this product suitable for outdoor or automotive use.

Terminal Finish: TIN

The use of tin terminal finish provides good conductivity and resistance to oxidation, ensuring stable and long-lasting connections in the circuit.

Terminal Position: DUAL

Having dual terminal positions offers redundancy and flexibility in connection options, reducing the risk of connection failures and enhancing reliability.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for slim and compact designs, making this product suitable for applications where space is limited.

Width: 3.9 mm

The narrow width of the product makes it easier to fit into tight spaces on a circuit board, maximizing the use of available PCB real estate.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering during assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering in lead-free processes, ensuring robust connections for long-term use.

Length: 4.9 mm

The compact length of the product facilitates easy integration into circuit designs, saving space and enabling high-density PCB layouts.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature tolerance ensures reliable performance in harsh automotive environments, making this product suitable for automotive applications.

Maximum Receive Delay: 6000 ns

The maximum receive delay ensures fast and efficient data transmission, making this product ideal for high-speed communication systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and thermal stability, ensuring secure connections and durability in demanding operating conditions.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics provide noise immunity and signal conditioning, ensuring reliable data transmission in noisy environments.

Nominal Supply Voltage: 12 V

The nominal supply voltage specification ensures compatibility with standard power sources, making this product easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact and efficient layouts on circuit boards, enabling high-density designs and reducing signal interference.

Moisture Sensitivity Level (MSL): 2

Having a low moisture sensitivity level indicates good resistance to moisture damage, ensuring reliability in humid or wet environments.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver interface IC type allows for seamless communication between different parts of a system, making this product essential for data transmission applications.

Technical Specifications

Line Drivers & Receivers NCV7321D10G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

27 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NCV7321D10G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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