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NCV7380DR2G

Onsemi

NCV7380DR2G by Onsemi

NCV7380DR2G by Onsemi is a Line Transceiver IC with 8 terminals, operating at -40 to 125 °C. It features Schmitt Trigger input characteristics, a max supply voltage of 5.5 V, and a transmit delay of 5000 ns. Ideal for automotive applications requiring reliable communication in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 32,000 parts In-Stock

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Vyrian

USA . 7,535 parts In-Stock

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7,535

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Digiode

USA . 1,979 parts In-Stock

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1,979

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Distributors (Availability)

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Vigor

Singapore . 891 parts In-Stock

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$0.510

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891

$0.510

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AZTECH Wire

Italy . 665 parts In-Stock

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$10.810

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665

$10.810

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$15.334

100+ parts

$13.954

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$12.574

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2,500

$15.334

$13.954

$12.574

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Component Stockers USA

USA . 591 parts In-Stock

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$99.990

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591

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Kulean Microsystems

USA . 6,585 parts In-Stock

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SupplyDigital Components

Austria . 4,004 parts In-Stock

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Problanco Electronics

Mexico . 2,809 parts In-Stock

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Assy Fe

Spain . 1,904 parts In-Stock

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TANS Electronics

Latvia . 897 parts In-Stock

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Corphita

USA . 569 parts In-Stock

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Microchip USA

USA . 432 parts In-Stock

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UHIMA Technologies

Türkiye . 272 parts In-Stock

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Corohmni

South Africa . 134 parts In-Stock

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Overview

Unlock seamless communication with the NCV7380DR2G by Onsemi. This high-quality line driver and receiver offers unparalleled reliability, making it the perfect choice for a wide range of applications. With Onsemi's reputation for excellence in manufacturing, you can trust that this product delivers exceptional performance. Experience the value and benefits of smooth signal transmission, precise timing, and efficient operation that the NCV7380DR2G brings to your projects. Elevate your designs with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance to external elements, making this product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto PCBs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product is compatible with common voltage levels in electronic systems, ensuring seamless operation.

Package Shape: RECTANGULAR

The rectangular shape of the package offers ease of handling and fitting within circuit designs, optimizing space utilization.

Maximum Transmit Delay: 5000 ns

The low maximum transmit delay of 5000ns ensures fast signal transmission, making this product ideal for applications requiring efficient communication.

Maximum Supply Voltage-1: 18 V

With a maximum supply voltage-1 of 18V, this product can handle higher voltage spikes or levels, enhancing its versatility in different operating conditions.

No. of Terminals: 8

Having 8 terminals allows for multiple input and output connections, enabling complex signal routing and communication capabilities in a single component.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices or systems with limited board real estate.

Minimum Supply Voltage-1: 7 V

The minimum supply voltage-1 of 7V ensures reliable operation even at lower power levels, providing flexibility in power input requirements.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5V, this product can function efficiently with low power sources, making it energy-efficient and cost-effective.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows this product to withstand elevated temperature environments without performance degradation, ensuring reliability in various conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables this product to operate in cold conditions, providing consistent performance in diverse temperature ranges.

Terminal Finish: Tin (Sn)

The use of tin terminal finish ensures good electrical conductivity and solderability, enhancing the reliability and lifespan of the product.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in component orientation during assembly, accommodating different PCB layouts and design requirements.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm allows for a slim profile, making this product suitable for applications where space constraints are a concern.

Width: 3.9 mm

The compact width of 3.9mm enables the product to be easily integrated into densely populated PCBs, optimizing board space utilization.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40s ensures proper soldering during assembly processes, contributing to the overall reliability of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand high-temperature soldering processes, ensuring robust connections on the PCB.

Length: 4.9 mm

The compact length of 4.9mm contributes to the overall small form factor of the product, allowing for space-efficient integration in electronic systems.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means this product meets strict quality and reliability standards for automotive applications, ensuring performance in demanding environments.

Maximum Receive Delay: 6000 ns

The maximum receive delay of 6000ns ensures timely processing of incoming signals, enabling efficient communication and data transfer capabilities.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure mounting on the PCB, enhancing the durability and stability of the product in operation.

Input Characteristics: SCHMITT TRIGGER

Having Schmitt trigger input characteristics enables robust signal processing with hysteresis, ensuring noise immunity and reliable operation in noisy environments.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V aligns with standard logic levels, making this product compatible with a wide range of digital systems and microcontrollers.

Terminal Pitch: 1.27 mm

The fine terminal pitch of 1.27mm allows for dense packing of components on the PCB, enabling high-density circuit designs and miniaturization.

Nominal Supply Voltage-1: 12 V

With a nominal supply voltage-1 of 12V, this product offers a suitable operating range for various electronic applications, ensuring compatibility with different power sources.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver interface IC type, this product enables bidirectional communication between different systems, making it versatile for various data transmission applications.

Technical Specifications

Line Drivers & Receivers NCV7380DR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

7 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Transmit Delay:

5000 ns

Width:

3.9 mm

Trade Compliance

NCV7380DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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