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NCV7321D10R2G

Onsemi

NCV7321D10R2G by Onsemi

NCV7321D10R2G by Onsemi is a Line Transceiver IC with 8 terminals, operating at -40 to 125 °C. It has a supply voltage range of 5-27 V and max receive delay of 6000 ns. Ideal for automotive applications due to its small outline package and Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 439 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,386 parts In-Stock

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SupplyDigital Components

Austria . 4,561 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

USA . 2,027 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 882 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 561 parts In-Stock

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South Africa . 478 parts In-Stock

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Overview

Boost your automotive electronics with the NCV7321D10R2G by Onsemi! This high-quality line driver and receiver offers exceptional reliability and performance, making it the perfect choice for a wide range of applications. With a compact design, dual terminals, and a wide operating temperature range, this product provides unparalleled value and benefits to customers. Trust Onsemi's expertise in semiconductor manufacturing to deliver cutting-edge solutions for all your automotive electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product resistant to environmental factors.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 27 V

Can handle higher voltage levels, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Efficient use of space on the PCB, making it ideal for compact designs.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components, offering flexibility in circuit design.

Minimum Supply Voltage: 5 V

Can operate at low voltage levels, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliability in harsh operating conditions.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Offers flexibility in PCB layout and design, allowing for efficient routing of signals.

Maximum Seated Height: 1.75 mm

Low profile design saves space on the PCB, making it suitable for compact designs.

Width: 3.9 mm

Compact size allows for efficient use of space on the PCB, ideal for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during the manufacturing process, leading to reliable connections.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the soldering process, ensuring proper assembly.

Length: 4.9 mm

Compact size allows for space-saving on the PCB, ideal for compact and miniaturized designs.

Temperature Grade: AUTOMOTIVE

Designed to operate in automotive environments, ensuring durability and reliability in vehicles.

Maximum Receive Delay: 6000 ns

Allows for precise signal transmission and reception, ensuring accurate data communication.

Terminal Form: GULL WING

Provides a secure and reliable connection on the PCB, ensuring long-term performance.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Provides signal conditioning and noise immunity, ensuring reliable data transmission in noisy environments.

Nominal Supply Voltage: 12 V

Suitable for standard voltage levels, making it compatible with a wide range of applications.

Terminal Pitch: 1.27 mm

Allows for efficient layout and routing of signals on the PCB, ensuring optimal signal integrity.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate levels of moisture, ensuring reliability in humid environments.

Interface IC Type: LINE TRANSCEIVER

Provides a versatile and reliable interface for transmitting and receiving signals, suitable for communication applications.

Technical Specifications

Line Drivers & Receivers NCV7321D10R2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

27 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NCV7321D10R2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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