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NCV7361D

Onsemi

NCV7361D by Onsemi

NCV7361D by Onsemi is a Line Driver IC with 18V max supply voltage, 4000ns max transmit delay, and Schmitt trigger input characteristics. Ideal for automotive applications due to its small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,299 parts In-Stock

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Vyrian

USA . 788 parts In-Stock

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788

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Problanco Electronics

Mexico . 7,732 parts In-Stock

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SupplyDigital Components

Austria . 5,035 parts In-Stock

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Kulean Microsystems

USA . 4,265 parts In-Stock

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Corphita

USA . 1,760 parts In-Stock

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TANS Electronics

Latvia . 1,248 parts In-Stock

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UHIMA Technologies

Türkiye . 951 parts In-Stock

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Corohmni

South Africa . 490 parts In-Stock

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Assy Fe

Spain . 83 parts In-Stock

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Overview

Unleash the power of reliable communication with the NCV7361D by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality line drivers and receivers that are perfect for automotive applications. With a maximum supply voltage of 18V and a wide temperature range, this product ensures consistent performance in any environment. Say goodbye to transmission delays with a maximum transmit delay of 4000ns and enjoy seamless connectivity with its Schmitt trigger input characteristics. Trust Onsemi to provide you with cutting-edge technology that offers unparalleled value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the product, making it ideal for various environmental conditions.

Maximum Supply Voltage: 18 V

The high maximum supply voltage allows for versatile use in different applications that may require higher voltage levels.

No. of Terminals: 8

Having 8 terminals provides flexibility for connecting multiple input and output devices, enhancing the functionality of the product.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures makes this product suitable for use in harsh environments or extreme weather conditions.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature, this product can withstand the soldering process during assembly without compromising performance.

Interface IC Type: LINE DRIVER

The use of a line driver interface IC ensures efficient signal transmission and reception, making this product a reliable choice for data communication applications.

Technical Specifications

Line Drivers & Receivers NCV7361D attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

4000 ns

Width:

3.9 mm

Trade Compliance

NCV7361D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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