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NCV7310DR2

Onsemi

NCV7310DR2 by Onsemi

NCV7310DR2 by Onsemi is a Line Transceiver IC with ISO 9141 interface standard. It operates in automotive applications, offering Schmitt Trigger input characteristics and a max supply voltage of 5.5V. With a small outline package style, it features a max transmit delay of 4000ns and can withstand temperatures from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,297 parts In-Stock

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Digiode

USA . 1,915 parts In-Stock

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1,915

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Distributors (Availability)

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Kulean Microsystems

USA . 7,768 parts In-Stock

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7,768

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Problanco Electronics

Mexico . 7,725 parts In-Stock

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7,725

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TANS Electronics

Latvia . 6,878 parts In-Stock

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SupplyDigital Components

Austria . 2,254 parts In-Stock

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UHIMA Technologies

Türkiye . 481 parts In-Stock

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481

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Corohmni

South Africa . 447 parts In-Stock

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447

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Corphita

USA . 374 parts In-Stock

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Overview

Enhance your automotive electronic systems with the NCV7310DR2 from Onsemi. Crafted with precision and expertise, this line driver and receiver delivers top-notch performance and reliability. Ideal for various applications, this product offers seamless integration and high-speed data transmission. With its compact design and superior quality, customers can trust in the value and benefits that this product brings to their projects. Upgrade your systems today with the NCV7310DR2 and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 5.5 V

Can handle a high supply voltage of up to 5.5 V, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape provides ease of handling and fitting in electronic setups.

Maximum Transmit Delay: 4000 ns

Low transmit delay ensures efficient data transmission.

No. of Terminals: 8

Sufficient number of terminals for connectivity and versatility in usage.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in various environmental conditions.

Interface Standard: ISO 9141

Complies with industry standard for seamless integration in automotive applications.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics ensure noise-immune signal processing.

Technical Specifications

Line Drivers & Receivers NCV7310DR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

ISO 9141

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Receive Delay:

4000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

20 V

Minimum Supply Voltage-1:

6 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

4000 ns

Width:

3.9 mm

Trade Compliance

NCV7310DR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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