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NCV7361DR2

Onsemi

NCV7361DR2 by Onsemi

NCV7361DR2 by Onsemi is a Line Driver IC with 8 terminals, operating b/w -40 to 125 °C. It features Schmitt Trigger input characteristics, max supply voltage of 18V, and transmit delay of 4000ns. Ideal for automotive applications requiring reliable signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,077 parts In-Stock

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Vyrian

USA . 2,060 parts In-Stock

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2,060

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Kulean Microsystems

USA . 8,075 parts In-Stock

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TANS Electronics

Latvia . 7,138 parts In-Stock

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SupplyDigital Components

Austria . 3,278 parts In-Stock

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Corphita

USA . 1,622 parts In-Stock

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Problanco Electronics

Mexico . 1,141 parts In-Stock

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UHIMA Technologies

Türkiye . 736 parts In-Stock

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736

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Corohmni

South Africa . 229 parts In-Stock

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Overview

Enhance your automotive electronics with the NCV7361DR2 by Onsemi, a top-notch Line Driver & Receiver that guarantees superior quality and reliability. Manufactured by Onsemi, a renowned leader in semiconductor solutions, this product delivers exceptional performance and precision. Perfect for a wide range of applications, this compact rectangular package boasts a maximum supply voltage of 18V and a minimum operating temperature of -40 °C, making it ideal for automotive environments. Upgrade your systems today with the NCV7361DR2 and experience unparalleled value, benefits, and advantages like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it suitable for compact designs.

Maximum Supply Voltage: 18 V

Can handle a wide range of supply voltages, making it versatile and compatible with various systems.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing circuit layouts.

Maximum Transmit Delay: 4000 ns

Fast transmit delay ensures efficient data transmission without significant delays.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components or devices.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space and facilitates easier installation.

Minimum Supply Voltage: 5.25 V

Can operate at a relatively low supply voltage, which may be advantageous in certain applications.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in cold environments.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity for reliable signal transmission.

Terminal Position: DUAL

Dual terminal position allows for easy insertion and connection to the circuit board.

Maximum Seated Height: 1.75 mm

Low seated height helps in maintaining a slim profile for the product.

Width: 3.9 mm

Narrow width saves space on the circuit board and facilitates compact designs.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps in fast and efficient assembly of the product on the circuit board.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures good soldering and connection to the circuit board.

Length: 4.9 mm

Optimal length for the product, balancing between space-saving and effective design.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, making it suitable for automotive applications.

Maximum Receive Delay: 6000 ns

Fast receive delay ensures quick reception of data signals, contributing to efficient communication.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering and robust connection to the circuit board.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics ensure stable and reliable signal processing, preventing signal noise interference.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy connection and compatibility with standard circuit board layouts.

Interface IC Type: LINE DRIVER

Specifically designed as a line driver, ensuring efficient and reliable communication between components in a circuit.

Technical Specifications

Line Drivers & Receivers NCV7361DR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

4000 ns

Width:

3.9 mm

Trade Compliance

NCV7361DR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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