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NCV7382D

Onsemi

NCV7382D by Onsemi

NCV7382D by Onsemi is a Line Transceiver IC with 8 terminals, operating at -40 to 125 °C. It features Schmitt Trigger input characteristics, with a max transmit delay of 5000 ns and receive delay of 6000 ns. Ideal for automotive applications due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 15,000 parts In-Stock

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15,000

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Vyrian

USA . 9,086 parts In-Stock

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9,086

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Digiode

USA . 927 parts In-Stock

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927

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Distributors (Availability)

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AZTECH Wire

Italy . 997 parts In-Stock

1+ parts

$21.600

100+ parts

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997

$21.600

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QUARKTWIN TECHNOLOGY LTD

USA . 29,889 parts In-Stock

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29,889

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Problanco Electronics

Mexico . 7,270 parts In-Stock

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7,270

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Kulean Microsystems

USA . 3,594 parts In-Stock

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3,594

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Microchip USA

USA . 3,442 parts In-Stock

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TANS Electronics

Latvia . 2,633 parts In-Stock

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2,633

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SupplyDigital Components

Austria . 397 parts In-Stock

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397

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Corohmni

South Africa . 397 parts In-Stock

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397

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UHIMA Technologies

Türkiye . 360 parts In-Stock

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360

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Corphita

USA . 244 parts In-Stock

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Vigor

Singapore . 198 parts In-Stock

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Overview

Enhance your automotive electronics with the top-notch performance of the NCV7382D by Onsemi. As a leading manufacturer in the industry, Onsemi delivers premium quality line drivers & receivers that guarantee reliability and efficiency. With a wide range of applications in automotive systems, industrial controls, and more, this product ensures seamless communication and optimal functionality. Experience the value of precision engineering and superior design with the NCV7382D, providing unmatched benefits and advantages to customers looking for exceptional performance in their electronic devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the overall weight of the product, making it more portable and easier to handle.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving space and making the product suitable for compact electronic devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance of 5.5V ensures compatibility with a wide range of electronic systems and power sources.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor that is easy to integrate into various electronic designs and layouts.

Maximum Transmit Delay: 5000 ns

The low maximum transmit delay of 5000 ns ensures quick and efficient data transmission, making the product suitable for high-speed communication applications.

Maximum Supply Voltage-1: 18 V

The high maximum supply voltage-1 rating of 18V provides additional protection against voltage spikes and fluctuations in the power supply.

No. of Terminals: 8

The 8 terminals offer connectivity options for a range of input and output signals, enhancing the versatility and functionality of the product.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space-saving installation on PCBs, making the product suitable for compact electronic devices with limited board space.

Minimum Supply Voltage-1: 7 V

The low minimum supply voltage-1 requirement of 7V allows the product to operate efficiently even with lower voltage power sources.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage rating of 4.5V ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance even in harsh environmental conditions or high-temperature applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function effectively in cold climates or refrigerated environments.

Terminal Finish: Tin/Lead (Sn80Pb20)

The tin/lead terminal finish provides excellent solderability and durability, ensuring long-lasting connections and reliable performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connection options, allowing for easy integration into different electronic systems.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm enables a slim and compact design, making the product suitable for applications with space constraints.

Width: 3.9 mm

The narrow width of 3.9mm allows for easy integration into tight spaces or densely populated PCB layouts.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C ensures secure solder joints and reliable connections during the assembly process.

Length: 4.9 mm

The compact length of 4.9mm contributes to the overall small form factor of the product, making it suitable for applications requiring a space-saving design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade designation indicates that the product meets stringent requirements for reliability and performance in automotive applications.

Maximum Receive Delay: 6000 ns

The low maximum receive delay of 6000 ns ensures timely reception of data signals, contributing to the overall efficiency and reliability of the product.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable connections during installation, ensuring long-term durability and performance.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics help in reducing signal noise and improving signal integrity, making the product suitable for noise-sensitive applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage requirement ensures compatibility with standard power sources and electronic systems, making the product easy to integrate into existing designs.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27mm allows for close spacing of terminals on PCBs, enabling high-density mounting and compact design layouts.

Nominal Supply Voltage-1: 12 V

The 12V nominal supply voltage-1 rating provides flexibility in power source compatibility, allowing the product to operate efficiently with a range of voltage levels.

Interface IC Type: LINE TRANSCEIVER

The use of a line transceiver interface IC type allows for bidirectional communication and signal conversion, making the product versatile and suitable for a variety of applications.

Technical Specifications

Line Drivers & Receivers NCV7382D attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

7 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

5000 ns

Width:

3.9 mm

Trade Compliance

NCV7382D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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