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NCV7381ADP0R2G

Onsemi

NCV7381ADP0R2G by Onsemi

NCV7381ADP0R2G by Onsemi is a Line Driver with 16 terminals, operating at -40 to 125 °C. It features a max supply voltage of 50V and differential output capability. Ideal for automotive applications requiring a robust interface IC with Schmitt trigger input characteristics.

Median Price

$2.060

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,584 parts In-Stock

1+ parts

$2.060

100+ parts

$1.240

1k+ parts

$1.100

10k+ parts

-

1,584

$2.060

$1.240

$1.100

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,136 parts In-Stock

1+ parts

$2.726

100+ parts

-

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1,136

$2.726

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Vyrian

USA . 879 parts In-Stock

1+ parts

$2.870

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879

$2.870

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Flip Electronics

USA . 90,000 parts In-Stock

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Chip Stock

USA . 52,000 parts In-Stock

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52,000

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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Corphita

USA . 857 parts In-Stock

1+ parts

$2.583

100+ parts

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857

$2.583

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Corohmni

South Africa . 265 parts In-Stock

1+ parts

$2.870

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265

$2.870

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SupplyDigital Components

Austria . 6,795 parts In-Stock

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6,795

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Problanco Electronics

Mexico . 4,874 parts In-Stock

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4,874

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Kulean Microsystems

USA . 4,051 parts In-Stock

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4,051

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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TANS Electronics

Latvia . 3,371 parts In-Stock

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3,371

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Lixinc

USA . 1,783 parts In-Stock

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1,783

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UHIMA Technologies

Türkiye . 79 parts In-Stock

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79

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Overview

onsemi Solutions for Automotive IVN & Lighting provides energy-efficient solutions for automotive In-Vehicle Networking (IVN) and lighting to reduce emissions, improve fuel economy, and enhance lighting, safety, connectivity, and infotainment power delivery systems. These cost-effective in-vehicle networking (IVN) and lighting solutions offer low power consumption and high reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on the PCB, making the product more efficient and compact.

Maximum Supply Voltage: 50 V

With a high maximum supply voltage of 50V, this product can handle a wide range of power input, providing flexibility and compatibility with different systems.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications where performance and durability are crucial.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can operate in harsh conditions without compromising performance, ensuring reliability in various environments.

Technical Specifications

Line Drivers & Receivers NCV7381ADP0R2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

1

Screening Level:

AEC-Q100

Maximum Seated Height:

1.99 mm

Maximum Supply Voltage:

50 V

Minimum Supply Voltage:

5.5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

NCV7381ADP0R2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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