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NCV7340D12R2G

Onsemi

NCV7340D12R2G by Onsemi

NCV7340D12R2G by Onsemi is an automotive-grade network interface IC with 8 terminals and a supply voltage of 5V. It operates at temperatures ranging from -40 to 125 °C, making it suitable for harsh environments. With a data rate of 1 Mbps, this IC is ideal for interfacing circuits in automotive applications.

Median Price

$0.559

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 125,000 parts In-Stock

1+ parts

-

100+ parts

$0.559

1k+ parts

$0.464

10k+ parts

$0.414

125,000

-

$0.559

$0.464

$0.414

Flip Electronics (Authorized)

USA . 120,000 parts In-Stock

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120,000

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Distributors (In-Stock)

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Digiode

USA . 1,727 parts In-Stock

1+ parts

$0.462

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1,727

$0.462

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Flip Electronics

USA . 115,800 parts In-Stock

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115,800

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Vyrian

USA . 8,105 parts In-Stock

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8,105

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Chip Stock

USA . 5,000 parts In-Stock

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5,000

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Distributors (Availability)

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Corphita

USA . 1,417 parts In-Stock

1+ parts

$0.437

100+ parts

-

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1,417

$0.437

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Corohmni

South Africa . 232 parts In-Stock

1+ parts

$0.486

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232

$0.486

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$20.580

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292

$20.580

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Component Stockers USA

USA . 473 parts In-Stock

1+ parts

$99.990

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473

$99.990

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TANS Electronics

Latvia . 8,363 parts In-Stock

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8,363

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Problanco Electronics

Mexico . 5,821 parts In-Stock

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5,821

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SupplyDigital Components

Austria . 5,790 parts In-Stock

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5,790

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Kulean Microsystems

USA . 4,598 parts In-Stock

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4,598

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Kepictronics

USA . 331 parts In-Stock

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331

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Vigor

Singapore . 201 parts In-Stock

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201

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Microchip USA

USA . 130 parts In-Stock

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130

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Perfect Parts

USA . 40 parts In-Stock

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40

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UHIMA Technologies

Türkiye . 16 parts In-Stock

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16

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Overview

Enhance your network interfaces with the NCV7340D12R2G by Onsemi, a top-quality product designed to deliver superior performance and reliability. Manufactured with precision and expertise, this interface circuit is perfect for automotive applications, offering seamless integration and optimal functionality. With a small outline package style and dual terminal position, this product guarantees easy installation and enhanced efficiency. Trust Onsemi to provide you with cutting-edge solutions that meet your needs and exceed your expectations. Elevate your networking experience with the NCV7340D12R2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides lightweight and durable construction, making the product suitable for use in various applications.

Surface Mount: YES

Enables easy installation on PCBs, saving space and simplifying assembly processes.

Screening Level: AEC-Q100

Ensures high reliability and quality standards required for automotive applications.

Power Supplies (V): 5

Operates at a standard voltage level, making it compatible with common power sources.

No. of Terminals: 8

Sufficient number of terminals for connecting multiple components or interfaces.

Package Style (Meter): SMALL OUTLINE

Compact design that saves space on the PCB and allows for efficient layout.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for automotive and industrial environments.

Terminal Finish: MATTE TIN

Provides corrosion resistance and reliable electrical connections.

Data Rate: 1 Mbps

Supports high-speed data transmission, suitable for networking applications.

Technical Specifications

Network Interfaces NCV7340D12R2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9276 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

NCV7340D12R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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