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NCV7327MW0R2G

Onsemi

NCV7327MW0R2G by Onsemi

NCV7327MW0R2G by Onsemi is an AEC-Q100 compliant LIN transceiver with 8 terminals, operating at -40 to 150°C. It has a data rate of 0.02 Mbps, nominal voltage of 12V, and low supply current of 6.5mA. Ideal for automotive applications requiring reliable network interfaces in compact spaces.

Median Price

$0.870

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,536 parts In-Stock

1+ parts

$0.870

100+ parts

$0.494

1k+ parts

$0.426

10k+ parts

-

1,536

$0.870

$0.494

$0.426

-

Mouser Electronics

USA . 774 parts In-Stock

1+ parts

$0.870

100+ parts

$0.495

1k+ parts

$0.427

10k+ parts

$0.384

774

$0.870

$0.495

$0.427

$0.384

Flip Electronics (Authorized)

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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15,000

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$0.444

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$0.444

-

-

-

Digiode

USA . 812 parts In-Stock

1+ parts

$0.884

100+ parts

-

1k+ parts

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812

$0.884

-

-

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Flip Electronics

USA . 16,361 parts In-Stock

1+ parts

-

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16,361

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Vyrian

USA . 6,631 parts In-Stock

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6,631

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Chip Stock

USA . 2,700 parts In-Stock

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2,700

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Martec Srl

Italy . 2,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,500

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,871 parts In-Stock

1+ parts

$0.444

100+ parts

-

1k+ parts

-

10k+ parts

$0.435

2,871

$0.444

-

-

$0.435

Argo Parts USA

USA . 1,874 parts In-Stock

1+ parts

$0.444

100+ parts

-

1k+ parts

-

10k+ parts

$0.430

1,874

$0.444

-

-

$0.430

Ampacity Inc.

Singapore . 6,910 parts In-Stock

1+ parts

$0.790

100+ parts

-

1k+ parts

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10k+ parts

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6,910

$0.790

-

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Semicontronic

India . 6,760 parts In-Stock

1+ parts

$0.790

100+ parts

$0.770

1k+ parts

$0.766

10k+ parts

-

6,760

$0.790

$0.770

$0.766

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Corphita

USA . 1,908 parts In-Stock

1+ parts

$0.837

100+ parts

-

1k+ parts

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1,908

$0.837

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Corohmni

South Africa . 326 parts In-Stock

1+ parts

$0.930

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326

$0.930

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Microchip USA

USA . 4,358 parts In-Stock

1+ parts

$2.688

100+ parts

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4,358

$2.688

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$11.740

100+ parts

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1,000

$11.740

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-

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SupplyDigital Components

Austria . 7,703 parts In-Stock

1+ parts

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7,703

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Problanco Electronics

Mexico . 7,541 parts In-Stock

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7,541

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TANS Electronics

Latvia . 7,417 parts In-Stock

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7,417

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Kulean Microsystems

USA . 2,346 parts In-Stock

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2,346

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 259 parts In-Stock

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259

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Overview

Discover the NCV7327MW0R2G by Onsemi, a top-of-the-line LIN transceiver designed for automotive applications. With a nominal supply voltage of 12V and a data rate of 0.02 Mbps, this small outline, heat sink package offers exceptional performance in extreme temperatures ranging from -40 to 150°C. Onsemi's AEC-Q100 screening level ensures quality and reliability, making it the perfect choice for network interfaces in automotive systems. Trust in Onsemi's reputation for excellence and invest in the NCV7327MW0R2G for superior connectivity and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for a compact design and easy assembly, making this product suitable for applications with space constraints.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures high reliability and quality standards, making this product ideal for automotive applications where durability is crucial.

Package Shape: SQUARE

The square package shape offers a balanced and stable form factor, making it easy to integrate into various electronic systems.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options, allowing for versatile and flexible usage in different setups.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in challenging situations.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this product to function effectively in both extreme cold and hot environments, offering versatility in application.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and excellent solderability, enhancing the durability and longevity of the product.

Terminal Position: DUAL

Dual terminal positioning adds redundancy and improves reliability, ensuring uninterrupted connectivity in case of one terminal failure.

Maximum Seated Height: 0.9 mm

The low maximum seated height contributes to a compact and sleek design, making it suitable for applications where space optimization is crucial.

Width: 3 mm

The compact width of 3mm enables easy integration into tight spaces, making this product suitable for small form factor devices.

Maximum Time At Peak Reflow Temperature (s): 30

The quick reflow time of 30 seconds minimizes assembly time and facilitates efficient manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering connections, reducing the risk of joint failure and enhancing overall product reliability.

Length: 3 mm

The short length of 3mm contributes to a space-saving design, making this product ideal for applications with size restrictions.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification signifies that this product can reliably operate in automotive environments, making it a suitable choice for automotive applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates lead-related hazards and complies with environmental regulations, making this product eco-friendly and safer to use.

Maximum Supply Current: 6.5 mA

The low maximum supply current of 6.5mA helps in conserving energy and reducing power consumption, making this product efficient and cost-effective.

Telecom IC Type: LIN TRANSCEIVER

Featuring LIN transceiver technology, this product allows for reliable and efficient communication in automotive and industrial applications, ensuring seamless data transmission.

Nominal Supply Voltage: 12 V

With a nominal supply voltage of 12V, this product is compatible with standard power sources, offering convenience and compatibility in various setups.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm enables high-density mounting and facilitates compact PCB layouts, making this product suitable for space-constrained designs.

Data Rate: 0.02 Mbps

The data rate of 0.02Mbps allows for efficient data transmission, making this product ideal for applications requiring moderate-speed communication.

Technical Specifications

Network Interfaces NCV7327MW0R2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

.02 Mbps

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Current:

6.5 mA

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCV7327MW0R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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