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NB7LQ572MNG

Onsemi

NB7LQ572MNG by Onsemi

NB7LQ572MNG clock driver by Onsemi features a low propagation delay of 0.25 ns, suitable for high-speed applications. With differential mux input conditioning and 32 terminals in a square chip carrier package, it operates at industrial temperatures from -40 to 85 °C. Ideal for systems requiring precise synchronization and fast signal transmission up to 6 MHz.

Median Price

$7.787

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 46 parts In-Stock

1+ parts

-

100+ parts

$6.230

1k+ parts

$5.580

10k+ parts

$5.250

46

-

$6.230

$5.580

$5.250

DigiKey

USA . 46 parts In-Stock

1+ parts

-

100+ parts

$8.200

1k+ parts

-

10k+ parts

-

46

-

$8.200

-

-

Verical

USA . 46 parts In-Stock

1+ parts

-

100+ parts

$7.787

1k+ parts

$6.975

10k+ parts

$6.563

46

-

$7.787

$6.975

$6.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,552 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

10k+ parts

-

1,552

$6.593

-

-

-

Vyrian

USA . 7,612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,612

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,757 parts In-Stock

1+ parts

$6.246

100+ parts

-

1k+ parts

-

10k+ parts

-

1,757

$6.246

-

-

-

Corohmni

South Africa . 222 parts In-Stock

1+ parts

$6.850

100+ parts

-

1k+ parts

-

10k+ parts

-

222

$6.850

-

-

-

Component Stockers USA

USA . 110 parts In-Stock

1+ parts

$7.150

100+ parts

-

1k+ parts

-

10k+ parts

-

110

$7.150

-

-

-

Microchip USA

USA . 2,907 parts In-Stock

1+ parts

$29.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,907

$29.400

-

-

-

SupplyDigital Components

Austria . 7,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,746

-

-

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Problanco Electronics

Mexico . 7,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,525

-

-

-

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Kulean Microsystems

USA . 6,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,586

-

-

-

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TANS Electronics

Latvia . 1,028 parts In-Stock

1+ parts

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100+ parts

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1,028

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-

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Continental Prestige Electronics

USA . 83 parts In-Stock

1+ parts

-

100+ parts

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83

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UHIMA Technologies

Türkiye . 50 parts In-Stock

1+ parts

-

100+ parts

-

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50

-

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Overview

Enhance your clock driver and buffering needs with the NB7LQ572MNG by Onsemi. Crafted with precision and expertise, this product offers unmatched quality and reliability in the Clock Drivers & Buffers category. Designed to optimize performance and efficiency, this chip carrier boasts a very thin profile, making it ideal for various industrial applications. Experience seamless differential mux input conditioning and ultra-fast propagation delay of 0.25 ns, ensuring precision timing for your projects. Trust Onsemi to deliver cutting-edge technology that exceeds expectations and adds exceptional value to your designs. Elevate your clock driver experience with the NB7LQ572MNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package provides durability and reliability for the product.

Propagation Delay At Nominal Supply: 0.25 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and facilitating automated assembly processes.

Input Conditioning: DIFFERENTIAL MUX

The differential multiplexer input conditioning helps in reducing noise and improving signal integrity, making this product suitable for critical applications.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage makes this product compatible with a wide range of systems and power supplies.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes this product suitable for industrial environments where temperature variations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function in cold conditions without any performance degradation.

Technical Specifications

Clock Drivers & Buffers NB7LQ572MNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

CAH ALSO USE 3.6 V SUPPLY

Family:

7L

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

6 MHz

Trade Compliance

NB7LQ572MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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