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NB3N2302DR2G

Onsemi

NB3N2302DR2G by Onsemi

NB3N2302DR2G clock driver by Onsemi has a propagation delay of 0.35 ns, operates at 3.3V, and supports up to 133 MHz frequency. It is ideal for applications requiring precise timing synchronization in industrial settings due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,793 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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Digiode

USA . 1,817 parts In-Stock

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1,817

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Distributors (Availability)

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AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$18.510

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212

$18.510

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SupplyDigital Components

Austria . 8,047 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,497 parts In-Stock

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Kulean Microsystems

USA . 5,518 parts In-Stock

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Problanco Electronics

Mexico . 5,189 parts In-Stock

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Corphita

USA . 1,643 parts In-Stock

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UHIMA Technologies

Türkiye . 892 parts In-Stock

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TANS Electronics

Latvia . 328 parts In-Stock

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Corohmni

South Africa . 202 parts In-Stock

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Microchip USA

USA . 133 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB3N2302DR2G clock driver and buffer by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge solutions in the Clock Drivers & Buffers category. This versatile product offers a seamless integration into various applications, providing customers with fast propagation delay, low power consumption, and precise timing control. Upgrade your systems with the NB3N2302DR2G and experience unmatched efficiency and accuracy in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Epoxy packaging provides durability and protection for the internal components of the clock driver, making it resistant to external elements.

Propagation Delay At Nominal Supply: 0.35 ns

Low propagation delay ensures efficient and quick signal transmission, leading to accurate clock synchronization.

Surface Mount: YES

Surface mount capability allows for easy installation and integration onto circuit boards, saving space and reducing complexity of design.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard 3.3V power supplies, making it suitable for a wide range of electronic devices and systems.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, ensuring reliable performance even under challenging conditions.

Technical Specifications

Clock Drivers & Buffers NB3N2302DR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

133 MHz

Trade Compliance

NB3N2302DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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