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N04L63W2AT27IT

Onsemi

N04L63W2AT27IT by Onsemi

N04L63W2AT27IT by Onsemi is a 256Kx16 SRAM with 3-STATE output, operating at 3V. It features a small outline package and operates in industrial temperature range. Ideal for applications requiring fast access time and low standby current.

Median Price

$3.860

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 735 parts In-Stock

1+ parts

-

100+ parts

$3.330

1k+ parts

$2.980

10k+ parts

$2.800

735

-

$3.330

$2.980

$2.800

DigiKey

USA . 735 parts In-Stock

1+ parts

-

100+ parts

$3.860

1k+ parts

-

10k+ parts

-

735

-

$3.860

-

-

Verical

USA . 735 parts In-Stock

1+ parts

-

100+ parts

$4.162

1k+ parts

$3.938

10k+ parts

-

735

-

$4.162

$3.938

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,338 parts In-Stock

1+ parts

$3.524

100+ parts

-

1k+ parts

-

10k+ parts

-

1,338

$3.524

-

-

-

Vyrian

USA . 2,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,226

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 324 parts In-Stock

1+ parts

$3.339

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$3.339

-

-

-

Corohmni

South Africa . 213 parts In-Stock

1+ parts

$3.710

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$3.710

-

-

-

Component Stockers USA

USA . 762 parts In-Stock

1+ parts

$3.840

100+ parts

$3.610

1k+ parts

-

10k+ parts

-

762

$3.840

$3.610

-

-

Kulean Microsystems

USA . 7,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,697

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,619

-

-

-

-

Problanco Electronics

Mexico . 7,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,185

-

-

-

-

Microchip USA

USA . 4,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,645

-

-

-

-

TANS Electronics

Latvia . 2,751 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,751

-

-

-

-

UHIMA Technologies

Türkiye . 513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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513

-

-

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SupplyDigital Components

Austria . 177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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177

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Overview

Unlock the power of reliable and efficient data storage with the N04L63W2AT27IT by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and performance in their products, making this SRAM a game-changer for various applications. With a compact package design and low power consumption, this memory device offers unparalleled value to customers seeking fast and secure data access. Say goodbye to slow processing times and hello to seamless operations with the N04L63W2AT27IT by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the SRAM chip, ensuring reliable performance and longevity.

Surface Mount: YES

Surface mount technology allows for easy installation and integration onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of electronic systems and devices.

No. of Terminals: 44

Having 44 terminals enables efficient connectivity and communication with other components in the system, making it versatile and compatible with various setups.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this SRAM chip can withstand high heat conditions, making it suitable for industrial applications.

Organization: 256KX16

With an organization of 256KX16, this SRAM chip offers a high memory capacity and data processing capabilities, ideal for applications requiring fast and efficient performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing the efficiency and reliability of the SRAM chip.

Maximum Access Time: 70 ns

The maximum access time of 70 nanoseconds indicates fast data retrieval and processing speeds, making this SRAM chip suitable for applications requiring quick response times.

Technical Specifications

SRAM N04L63W2AT27IT attributes and parameters. Explore more SRAM devices from Onsemi

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

Length:

18.41 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.25 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

1.8 V

Sub-Category:

SRAMs

Maximum Supply Current:

16 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

N04L63W2AT27IT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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