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MTC-20285-I

Onsemi

MTC-20285-I by Onsemi

The Onsemi MTC-20285-I is a digital transmission interface IC with 144 terminals in a square flatpack package. It operates b/w -40 °C to 85°C, making it suitable for industrial applications. Featuring gull wing terminals and a terminal pitch of 0.65mm, it is commonly used as an ISDN controller in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,457 parts In-Stock

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2,457

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Vyrian

USA . 1,502 parts In-Stock

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1,502

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,027 parts In-Stock

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7,027

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TANS Electronics

Latvia . 6,386 parts In-Stock

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6,386

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Problanco Electronics

Mexico . 5,602 parts In-Stock

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5,602

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Corphita

USA . 2,399 parts In-Stock

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2,399

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SupplyDigital Components

Austria . 1,105 parts In-Stock

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Corohmni

South Africa . 329 parts In-Stock

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329

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UHIMA Technologies

Türkiye . 230 parts In-Stock

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Overview

Unlock seamless digital communication with the MTC-20285-I by Onsemi, a cutting-edge ISDN controller designed to revolutionize your telecom experience. Crafted with precision and expertise by Onsemi, this high-quality Digital Transmission Interface offers unparalleled performance and reliability. Say goodbye to connectivity issues and hello to smooth, uninterrupted communication with this innovative product. Whether you're a tech enthusiast or a business professional, the MTC-20285-I is sure to elevate your digital experience to new heights. Upgrade today and discover the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to corrosion, making it suitable for long-term use in a variety of environments.

Surface Mount: YES

Being a surface mount component, this product is easy to install and saves space on a circuit board, allowing for efficient use of available. space.

No. of Terminals: 144

With a high number of terminals, this product offers a wide range of connection options and allows for versatile configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures that this product can perform reliably even in challenging environmental conditions.

Terminal Form: GULL WING

The gull wing terminal form provides ease of soldering and mounting, making installation of this product smooth and hassle-free.

Telecom IC Type: ISDN CONTROLLER

The ISDN controller type makes this product specifically designed for telecommunications applications, ensuring optimal performance and compatibility in such environments.

Technical Specifications

Digital Transmission Interfaces MTC-20285-I attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3.91 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

MTC-20285-I Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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