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MPS750G

Onsemi

MPS750G by Onsemi

MPS750G by Onsemi is a PNP BJT transistor with 3 terminals, max. power dissipation of 1.5W, and max. collector current of 2A. Ideal for amplifier applications, it has a min. DC current gain of 40 (hFE), operates up to 150 °C, and offers a nominal transition frequency of 75MHz in a cylindrical package style.

Median Price

$4.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DF Sales Co.

USA . 71 parts In-Stock

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DF Sales Co.

USA . 71 parts In-Stock

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Chip Stock

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Vyrian

USA . 7,095 parts In-Stock

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Digiode

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J2 Sourcing AB

Sweden . 1,569 parts In-Stock

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Corohmni

South Africa . 68 parts In-Stock

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AZTECH Wire

Italy . 1,097 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

USA . 22,017 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,366 parts In-Stock

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Infinite Electronics LLP (Excess)

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Problanco Electronics

Mexico . 4,114 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 3,409 parts In-Stock

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SupplyDigital Components

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Corphita

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UHIMA Technologies

Türkiye . 324 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the MPS750G by Onsemi. Crafted with precision and expertise, this PNP Small Signal Bipolar Junction Transistor offers exceptional performance and reliability. Ideal for amplifier applications, the MPS750G boasts a maximum operating temperature of 150 °C and a nominal transition frequency of 75 MHz. With a minimum DC current gain of 40 and a maximum collector-emitter voltage of 40V, this transistor delivers top-notch functionality and efficiency. Elevate your designs with the superior quality and value that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: PNP

PNP transistors are commonly used in amplifier circuits, making this transistor ideal for amplifier applications.

Configuration: SINGLE

The single configuration simplifies the design and integration of this transistor into circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal amplification.

Package Shape: ROUND

The round shape allows for easy mounting and integration into circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure connection and ease of soldering during circuit assembly.

No. of Terminals: 3

With 3 terminals, this transistor can be easily connected in a circuit for signal amplification.

Maximum Power Dissipation (Abs): 1.5 W

The high power dissipation capability allows this transistor to handle large signals without overheating.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides a compact and space-saving design for applications with limited space.

Minimum DC Current Gain (hFE): 40

The minimum DC current gain ensures stable and reliable amplification of signals in the circuit.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures in various applications.

Maximum Collector-Emitter Voltage: 40 V

The high maximum collector-emitter voltage rating allows for use in applications with higher voltage requirements.

Transistor Element Material: SILICON

Silicon transistors offer high performance, reliability, and efficiency in signal amplification.

Maximum Collector Current (IC): 2 A

With a high maximum collector current rating, this transistor can handle larger output currents in the circuit.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance for reliable connection and performance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and connection in the circuit.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this transistor can withstand the soldering process during circuit assembly.

Nominal Transition Frequency (fT): 75 MHz

The high nominal transition frequency ensures fast switching and amplification of signals in high-frequency applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MPS750G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

2 A

Maximum Collector-Emitter Voltage:

40 V

Configuration:

Minimum DC Current Gain (hFE):

40

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPS750G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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