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MMUN2231LT1G

Onsemi

MMUN2231LT1G by Onsemi

MMUN2231LT1G by Onsemi is a NPN BJT transistor with built-in resistor for switching applications. It has a max collector-emitter voltage of 50V, collector current of 0.1A, and power dissipation of 0.4W. This surface-mount device comes in a small outline package suitable for high-temperature environments up to 150 °C.

Median Price

$0.027

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Newark

USA . 48,810 parts In-Stock

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$0.006

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48,810

$0.006

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DigiKey

USA . 47,119 parts In-Stock

1+ parts

$0.170

100+ parts

$0.063

1k+ parts

$0.040

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47,119

$0.170

$0.063

$0.040

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Mouser Electronics

USA . 11,236 parts In-Stock

1+ parts

$0.170

100+ parts

$0.063

1k+ parts

$0.040

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$0.027

11,236

$0.170

$0.063

$0.040

$0.027

EBV Elektronik

Germany . 234,000 parts In-Stock

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Arrow

USA . 114,000 parts In-Stock

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$0.027

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Verical

USA . 114,000 parts In-Stock

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$0.027

Farnell

UK . 32,718 parts In-Stock

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$0.037

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$0.033

32,718

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$0.037

$0.033

Element14

Singapore . 32,718 parts In-Stock

1+ parts

-

100+ parts

$0.088

1k+ parts

$0.056

10k+ parts

$0.055

32,718

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$0.088

$0.056

$0.055

Master Electronics

USA . 30,000 parts In-Stock

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$0.027

30,000

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$0.027

Chip1Stop

Japan . 9,213 parts In-Stock

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$0.026

9,213

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$0.026

Rochester

USA . 5,495 parts In-Stock

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$0.020

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$0.017

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$0.015

5,495

-

$0.020

$0.017

$0.015

Distributors (In-Stock)

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Digiode

USA . 1,662 parts In-Stock

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$0.006

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1,662

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IBS Electronics

USA . 111,000 parts In-Stock

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$0.038

111,000

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$0.038

Chip Stock

USA . 73,000 parts In-Stock

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NAC Semi

USA . 33,000 parts In-Stock

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J2 Sourcing AB

Sweden . 11,790 parts In-Stock

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11,790

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ComSIT Distribution GmbH

Germany . 6,039 parts In-Stock

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Vyrian

USA . 5,956 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,118 parts In-Stock

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$0.005

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1,118

$0.005

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Corohmni

South Africa . 283 parts In-Stock

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$0.006

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283

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Component Stockers USA

USA . 1,595,167 parts In-Stock

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$0.020

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$0.020

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$0.020

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$0.010

1,595,167

$0.020

$0.020

$0.020

$0.010

GreenTree Electronics

Israel . 1,443,000 parts In-Stock

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Eastek

USA . 1,422,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,362,000 parts In-Stock

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Perfect Parts

USA . 833,645 parts In-Stock

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Kepictronics

USA . 51,000 parts In-Stock

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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Glotronic Ltd.

UK . 29,210 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,573 parts In-Stock

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Continental Prestige Electronics

USA . 21,354 parts In-Stock

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$0.022

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Kulean Microsystems

USA . 5,899 parts In-Stock

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SupplyDigital Components

Austria . 4,708 parts In-Stock

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Problanco Electronics

Mexico . 1,961 parts In-Stock

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TANS Electronics

Latvia . 490 parts In-Stock

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490

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UHIMA Technologies

Türkiye . 383 parts In-Stock

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383

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Overview

Enhance your electronic designs with the MMUN2231LT1G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This small signal bipolar junction transistor (BJT) is perfect for switching applications, offering customers a single configuration with a built-in resistor for added convenience. With a maximum collector-emitter voltage of 50V and a minimum DC current gain of 8, this NPN transistor provides exceptional performance in a compact package. Trust Onsemi to deliver innovation and value in every component, making the MMUN2231LT1G an essential choice for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal stability, making the transistor reliable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching applications, offering good performance and versatility.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and can help in reducing the component count, saving space and costs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can efficiently control the flow of current in electronic circuits.

Surface Mount: YES

Surface mount technology allows for automated PCB assembly, increasing productivity and reliability in mass production.

Maximum Power Dissipation (Abs): 0.4 W

With a high maximum power dissipation, this transistor can handle moderate power levels without overheating.

Terminal Form: GULL WING

The gull wing terminal form offers robust mechanical support and ease of soldering during assembly.

No. of Terminals: 3

Having 3 terminals allows for efficient control and connection in the circuit layout.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 50 V

Suitable for low to moderate voltage applications, this transistor can handle up to 50V safely.

Maximum Collector Current (IC): 0.1 A

This transistor can handle up to 0.1A collector current, suitable for low-power switching circuits.

Minimum DC Current Gain (hFE): 8

The minimum DC current gain of 8 ensures stable and consistent amplification in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact circuit designs.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making them a preferred choice in various electronic applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Terminal Position: DUAL

Having dual terminal positions allows for flexible PCB layout and easy connection to other components.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature ensures proper soldering and joint formation during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures proper solder melting and joint reliability during PCB assembly.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MMUN2231LT1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

8

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMUN2231LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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