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MMUN2115LT1G

Onsemi

MMUN2115LT1G by Onsemi

MMUN2115LT1G by Onsemi is a PNP BJT transistor with a max collector-emitter voltage of 50V and a min DC current gain of 160. It is designed for switching applications, features a small outline package style, and can operate at temperatures up to 150°C. Ideal for surface mount designs requiring high power dissipation and reliable performance.

Median Price

$0.042

Lifecycle Status

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26

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1k+

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Chip1Stop

Japan . 37,662 parts In-Stock

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$0.010

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DigiKey

USA . 2,082 parts In-Stock

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$0.160

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$0.059

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$0.038

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$0.026

2,082

$0.160

$0.059

$0.038

$0.026

Mouser Electronics

USA . 12,617 parts In-Stock

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$0.170

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$0.063

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$0.040

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Arrow

USA . 327,000 parts In-Stock

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Verical

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EBV Elektronik

Germany . 294,000 parts In-Stock

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Avnet

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Farnell

UK . 45,000 parts In-Stock

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Rochester

USA . 44,600 parts In-Stock

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Flip Electronics (Authorized)

USA . 2,480 parts In-Stock

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Digiode

USA . 2,405 parts In-Stock

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$0.024

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Nova Conductors

Japan . 90 parts In-Stock

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IBS Electronics

USA . 21,000 parts In-Stock

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$0.042

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$0.032

21,000

$0.042

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$0.032

TME

Poland . 3,026 parts In-Stock

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$0.150

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$0.057

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$0.035

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$0.021

3,026

$0.150

$0.057

$0.035

$0.021

Component Electronics Inc.

Canada . 100 parts In-Stock

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$0.770

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$0.580

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$0.500

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100

$0.770

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NAC Semi

USA . 234,000 parts In-Stock

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Flip Electronics

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Chip Stock

USA . 58,000 parts In-Stock

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Vyrian

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R&J Components

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Lantek

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

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LIBRA Elektronik GmbH

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Avant Electronics Limited

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Cyclops Electronics Ltd

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Ampacity Inc.

Singapore . 44,541 parts In-Stock

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Corohmni

South Africa . 350 parts In-Stock

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Corphita

USA . 1,687 parts In-Stock

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Argo Parts USA

USA . 293 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 45,000 parts In-Stock

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Kepictronics

USA . 360,000 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

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Eastek

USA . 39,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,667 parts In-Stock

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Lixinc

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GreenTree Electronics

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SupplyDigital Components

Austria . 8,220 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,700 parts In-Stock

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Assy Fe

Spain . 2,800 parts In-Stock

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TANS Electronics

Latvia . 1,106 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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UHIMA Technologies

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Overview

Upgrade your electronics with the MMUN2115LT1G by Onsemi, a top-quality small signal BJT transistor designed for switching applications. With a single configuration and built-in resistor, this PNP transistor offers exceptional performance and reliability. Ideal for surface mount installations, this rectangular package boasts a gull wing terminal form for easy integration. Experience the benefits of a high DC current gain of 160 and maximum power dissipation of 0.4W, providing unmatched efficiency and durability. Transform your projects with the MMUN2115LT1G and enjoy unrivaled quality from a trusted manufacturer like Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: PNP

PNP transistors are commonly used in low-power switching applications and this type can be easily integrated into existing circuit designs.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space on the PCB, making this transistor a convenient choice for compact designs.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers efficient performance in turning circuits on and off.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable performance in various operating conditions.

No. of Terminals: 3

With three terminals, this transistor can easily be integrated into circuits requiring specific connections and functionality.

Maximum Power Dissipation (Abs): 0.4 W

With a maximum power dissipation of 0.4W, this transistor can handle moderate power levels, making it suitable for low-power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs where board real estate is limited.

Minimum DC Current Gain (hFE): 160

A minimum DC current gain of 160 ensures reliable amplification of input signals, providing stable and consistent performance in various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high temperatures, ensuring reliable operation in demanding environments.

Maximum Collector-Emitter Voltage: 50 V

The maximum collector-emitter voltage of 50V allows this transistor to be used in circuits with moderate voltage levels, making it versatile for a range of applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor fabrication, providing stable performance and good thermal conductivity for efficient operation.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1A, this transistor is suitable for low-power applications where precise current handling is required.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good conductivity and corrosion resistance, ensuring reliable connections for optimal transistor performance.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit layout and connection options, making this transistor versatile for various design requirements.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures safe and efficient soldering during assembly, maintaining component integrity.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering of the transistor onto the PCB, ensuring secure connections and stable performance.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MMUN2115LT1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

160

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMUN2115LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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