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MJW16010

Onsemi

MJW16010 by Onsemi

MJW16010 by Onsemi is a NPN Power BJT with 150W power dissipation, 450V max. collector-emitter voltage, and 15A max. collector current. Ideal for switching applications, it features a single configuration in a rectangular package with through-hole terminals.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 735 parts In-Stock

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MISTER SPROCKETS

USA . 397 parts In-Stock

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Vyrian

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Kulean Microsystems

USA . 7,317 parts In-Stock

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Problanco Electronics

Mexico . 7,052 parts In-Stock

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SupplyDigital Components

Austria . 6,984 parts In-Stock

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TANS Electronics

Latvia . 6,171 parts In-Stock

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Corohmni

South Africa . 271 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 2 parts In-Stock

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Overview

Unleash the power of innovation with the Onsemi MJW16010 Power Bipolar Junction Transistor. Manufactured by industry leader Onsemi, this NPN transistor is designed for high-performance switching applications. With a maximum power dissipation of 150W and a collector-emitter voltage of 450V, the MJW16010 offers unmatched reliability and efficiency. Whether you're looking to optimize your power supply or enhance your electronic design, this transistor delivers superior performance and value. Upgrade your technology with the Onsemi MJW16010 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN type transistors are commonly used in switching applications due to their versatility and efficiency.

Configuration: SINGLE

Simplified design and easy to use for straightforward switching applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in this particular function.

Package Shape: RECTANGULAR

Compact and space-saving design suitable for various mounting configurations.

Terminal Form: THROUGH-HOLE

Allows for easy and secure connection to circuit boards or other components.

Maximum Power Dissipation (Abs): 150 W

Capable of handling high power levels, making it reliable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Enables easy and secure mounting of the transistor in various setups.

Minimum DC Current Gain (hFE): 5

Ensures proper amplification and reliable switching performance in the circuit.

Maximum Collector-Emitter Voltage: 450 V

Can withstand high voltage levels, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon transistors offer reliable performance and high efficiency in various conditions.

Maximum Collector Current (IC): 15 A

Capable of handling high current levels, suitable for applications where high power is required.

Terminal Finish: TIN LEAD

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: SINGLE

Simplified connection setup, making it easy to integrate into the circuit.

Case Connection: COLLECTOR

Clearly defines the connection point for the collector terminal, ensuring proper circuit arrangement.

Peak Reflow Temperature °C: 235

Capable of withstanding high-temperature soldering processes, ensuring proper assembly and connection.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJW16010 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

450 V

Configuration:

Minimum DC Current Gain (hFE):

5

JEDEC-95 Code:

TO-247AE

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MJW16010 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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