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MJ15002G

Onsemi

MJ15002G by Onsemi

MJ15002G by Onsemi is a PNP BJT transistor with 200W power dissipation, 140V max collector-emitter voltage, and 15A max collector current. Ideal for amplifier applications due to its single configuration and silicon element material. Package style is flange mount with round shape and bottom terminal position.

Median Price

$1.781

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$1.781

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300

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Vyrian

USA . 9,746 parts In-Stock

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Digiode

USA . 258 parts In-Stock

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258

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$0.411

100+ parts

$0.374

1k+ parts

$0.337

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50

$0.411

$0.374

$0.337

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AZTECH Wire

Italy . 1,073 parts In-Stock

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$21.580

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1,073

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QUARKTWIN TECHNOLOGY LTD

USA . 22,059 parts In-Stock

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Kulean Microsystems

USA . 6,874 parts In-Stock

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6,874

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TANS Electronics

Latvia . 4,552 parts In-Stock

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Problanco Electronics

Mexico . 3,418 parts In-Stock

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SupplyDigital Components

Austria . 2,669 parts In-Stock

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2,669

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Corphita

USA . 2,450 parts In-Stock

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UHIMA Technologies

Türkiye . 806 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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Overview

The MJ15002G by Onsemi is a top-of-the-line Power Bipolar Junction Transistor (BJT) that delivers unparalleled performance and reliability. With a maximum power dissipation of 200W and a maximum collector current of 15A, this PNP transistor is perfect for amplifier applications where high power handling capabilities are essential. Onsemi's reputation for quality and innovation shines through in every aspect of this product, from its durable metal package body to its superior silicon transistor element material. Trust the MJ15002G to deliver exceptional value and efficiency in your next project.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides good thermal conductivity and mechanical strength, ensuring efficient heat dissipation and durability.

Polarity or Channel Type: PNP

The PNP configuration allows for easy integration into circuits and compatible with common designs.

Configuration: SINGLE

Single configuration simplifies circuit design and makes it easier to use in various applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals.

Package Shape: ROUND

Round package shape provides uniform stress distribution and easy mounting in various systems.

Terminal Form: PIN/PEG

Pin/peg terminal form offers simple and secure connections for easy installation.

Maximum Power Dissipation (Abs): 200 W

High maximum power dissipation allows for reliable operation under demanding conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides a secure and stable mounting option for reliable performance.

Minimum DC Current Gain (hFE): 25

Minimum DC current gain of 25 ensures consistent and stable amplification of signals.

Maximum Operating Temperature: 200 °C

High maximum operating temperature allows for reliable performance in a wide range of environments.

Maximum Collector-Emitter Voltage: 140 V

High maximum collector-emitter voltage ensures the transistor can handle high voltage applications.

Transistor Element Material: SILICON

Silicon transistor element material offers high performance and reliability in electronic circuits.

Maximum Collector Current (IC): 15 A

High maximum collector current allows for handling large currents in electronic circuits.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and connections in various applications.

Case Connection: COLLECTOR

Collector case connection simplifies circuit design and improves thermal management in the system.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering process during assembly.

Nominal Transition Frequency (fT): 2 MHz

High nominal transition frequency allows for fast switching speeds and high-frequency operation in circuits.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJ15002G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

140 V

Configuration:

Minimum DC Current Gain (hFE):

25

JEDEC-95 Code:

TO-204AA

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJ15002G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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