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MC74VHCT02AMELG

Onsemi

MC74VHCT02AMELG by Onsemi

MC74VHCT02AMELG by Onsemi is a 4-function logic gate with 2 inputs, operating at 5V. It has a propagation delay of 8.5ns and can handle load capacitance of 50pF. Ideal for industrial applications requiring fast signal processing in compact spaces due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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1k+

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Vyrian

USA . 7,158 parts In-Stock

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Digiode

USA . 718 parts In-Stock

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AZTECH Wire

Italy . 995 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,991 parts In-Stock

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TANS Electronics

Latvia . 7,481 parts In-Stock

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Problanco Electronics

Mexico . 5,446 parts In-Stock

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Microchip USA

USA . 5,118 parts In-Stock

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Kulean Microsystems

USA . 4,210 parts In-Stock

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SupplyDigital Components

Austria . 3,800 parts In-Stock

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Corphita

USA . 1,144 parts In-Stock

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UHIMA Technologies

Türkiye . 546 parts In-Stock

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Corohmni

South Africa . 456 parts In-Stock

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Overview

Enhance your electronic projects with the MC74VHCT02AMELG logic gates by Onsemi. With a reputation for high-quality manufacturing, Onsemi delivers reliable products for a wide range of applications. This logic gate offers a fast propagation delay and low power consumption, making it ideal for efficient circuit design. Whether you're a hobbyist or a professional, this product provides excellent value and performance. Upgrade your projects today with the MC74VHCT02AMELG and experience the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 8.5 ns

With a low propagation delay at nominal supply, the logic gates can process signals quickly and efficiently, making them suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and integration of these logic gates easier and more flexible in a variety of electronic devices and systems.

No. of Functions: 4

Having multiple functions in a single component increases the versatility and functionality of the logic gates, allowing for more complex logic operations to be performed.

No. of Inputs: 2

With two inputs, these logic gates can perform basic logical operations such as AND, OR, and NOT, making them suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes these logic gates compatible with standard electronic systems and ensures consistent performance.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable operation and efficient signal processing in the presence of external capacitive loads.

Power Supplies (V): 5

Having a power supply voltage of 5V ensures compatibility with common electronic systems and simplifies power management for the logic gates.

No. of Terminals: 14

Having 14 terminals provides a sufficient number of connection points for interfacing with other components and circuits, enhancing versatility and compatibility.

Maximum I (ol): 8 Amp

The high maximum output current of 8 Amps allows these logic gates to drive loads with ease, making them suitable for driving various components in a circuit.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, these logic gates can withstand higher temperatures, ensuring reliable operation in harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, these logic gates can operate in cold environments without sacrificing performance or reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

Having dual terminal positions allows for easier installation and better accessibility when connecting the logic gates to other components or circuits.

Maximum Seated Height: 2.05 mm

The low maximum seated height of 2.05 mm makes these logic gates suitable for compact electronic devices and systems with space constraints.

Width: 5.275 mm

The compact width of 5.275 mm allows for easy integration of these logic gates into tight spaces or densely populated circuit boards.

Minimum Supply Voltage (Vsup): 4.5 V

Operating at a minimum supply voltage of 4.5V ensures compatibility with a wide range of power sources and electronic systems, providing flexibility in design.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, these logic gates can withstand high-temperature soldering processes during assembly without damage or degradation.

Length: 10.2 mm

The length of 10.2 mm provides a compact form factor for these logic gates, making them suitable for applications where space-saving is essential.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures that these logic gates can operate reliably in harsh industrial environments with varying temperature conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making these logic gates efficient and reliable for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliable electrical connections for the logic gates.

Packing Method: TR

The TR packing method offers protection and ease of handling during transportation and storage, ensuring that the logic gates arrive in optimal condition for use.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy alignment and soldering of the logic gates on standard PCBs or circuit boards, simplifying the assembly process.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that these logic gates can withstand moderate exposure to moisture during storage and assembly processes without damage or degradation.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, these logic gates can handle higher voltage levels while ensuring safe and reliable operation within specified limits.

Technical Specifications

Logic Gates MC74VHCT02AMELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHCT02AMELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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