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MC74VHC1G50P5T5G-L22088

Onsemi

MC74VHC1G50P5T5G-L22088 by Onsemi

MC74VHC1G50P5T5G-L22088 by Onsemi is a 3-STATE logic gate with 10ns propagation delay at 5V. It has a load capacitance of 50pF and can handle up to 8A output current. Ideal for applications requiring fast signal processing in compact designs with surface mount technology.

Median Price

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1k+

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Vyrian

USA . 4,445 parts In-Stock

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Digiode

USA . 473 parts In-Stock

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Microchip USA

USA . 10,879 parts In-Stock

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$0.379

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AZTECH Wire

Italy . 496 parts In-Stock

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Component Stockers USA

USA . 202 parts In-Stock

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TANS Electronics

Latvia . 6,663 parts In-Stock

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Kulean Microsystems

USA . 4,940 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Corphita

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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Overview

Discover the MC74VHC1G50P5T5G-L22088 by Onsemi, a high-quality logic gate that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted industry leader, this product is perfect for a wide range of applications. With fast propagation delay and low power consumption, this logic gate provides exceptional value to customers seeking efficient solutions. Its compact design and versatile features make it ideal for projects where space is limited. Upgrade your circuits with the MC74VHC1G50P5T5G-L22088 and experience the benefits of top-notch quality and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay allows for fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easy and efficient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with many systems and circuits.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable and reliable performance in various circuit environments.

No. of Terminals: 5

Having 5 terminals allows for versatile connectivity options and integration with other components in a circuit.

Maximum I (ol): 8 Amp

High output current capability enables this logic gate to drive larger loads without external amplification.

Output Characteristics: 3-STATE

3-state output allows for additional flexibility in controlling signal flow, enhancing the versatility of this product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy-efficient and reliable.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliable performance in varying environmental conditions.

Technical Specifications

Logic Gates MC74VHC1G50P5T5G-L22088 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-F5

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

14.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

MC74VHC1G50P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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