Loading...

MC74VHC1G50DFT1

Onsemi

MC74VHC1G50DFT1 by Onsemi

MC74VHC1G50DFT1 by Onsemi is a logic gate with 10ns propagation delay, 3.3V nominal voltage, and 50pF load capacitance. Ideal for military applications due to its CMOS technology, it operates b/w -55 °C to 125°C and has a max seated height of 1.1mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,685

-

-

-

-

Digiode

USA . 1,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

-

-

-

-

J2 Sourcing AB

Sweden . 38 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 211 parts In-Stock

1+ parts

$13.770

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$13.770

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,795

-

-

-

-

SupplyDigital Components

Austria . 5,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,548

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,739

-

-

-

-

TANS Electronics

Latvia . 2,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

-

-

-

-

Kulean Microsystems

USA . 2,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,004

-

-

-

-

UHIMA Technologies

Türkiye . 924 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

924

-

-

-

-

Problanco Electronics

Mexico . 363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

363

-

-

-

-

Corphita

USA . 359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

359

-

-

-

-

Microchip USA

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Corohmni

South Africa . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92

-

-

-

-

Overview

Discover the high-quality MC74VHC1G50DFT1 logic gate by Onsemi, a leading manufacturer in the industry. Ideal for a wide range of applications, this product offers fast propagation delay and reliable performance at a nominal supply voltage of 3.3V. With a compact design and dual terminal position, it provides customers with ease of use and flexibility in their projects. Trust Onsemi's expertise in producing top-notch components and elevate your designs with the value and benefits that the MC74VHC1G50DFT1 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures fast response time, making this logic gate suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common nominal supply voltage of 3.3V, making it compatible with a wide range of systems and devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this logic gate can withstand elevated temperatures and harsh environments.

Technology: CMOS

Utilizes CMOS technology, which offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Logic Gates MC74VHC1G50DFT1 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

MC74VHC1G50DFT1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20