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MC74VHC1G05DTT1G

Onsemi

MC74VHC1G05DTT1G by Onsemi

MC74VHC1G05DTT1G by Onsemi is a CMOS logic gate with 3V nominal voltage, 14.5ns propagation delay, and 8A max I (ol). It is used in military-grade applications for open-drain output characteristics and operates b/w -55 to 125 °C.

Median Price

$0.097

Lifecycle Status

Suppliers In-Stock

17

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1k+

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Arrow

USA . 23 parts In-Stock

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$0.045

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Farnell

UK . 145,168 parts In-Stock

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Rochester

USA . 69,539 parts In-Stock

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$0.075

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DigiKey

USA . 69,539 parts In-Stock

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Verical

USA . 30,000 parts In-Stock

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$0.070

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EBV Elektronik

Germany . 15,000 parts In-Stock

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Element14

Singapore . 2,763 parts In-Stock

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$0.194

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Mouser Electronics

USA . 87 parts In-Stock

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Chip1Stop

Japan . 48 parts In-Stock

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Digiode

USA . 1,312 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Chip Stock

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Prism Electronics

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Vyrian

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Connect4Technologies Inc.

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Bristol Electronics

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Speed Components Ltd

Israel . 20 parts In-Stock

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Semicontronic

India . 42,539 parts In-Stock

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$0.055

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$0.054

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$0.053

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Ampacity Inc.

Singapore . 42,219 parts In-Stock

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Corphita

USA . 1,653 parts In-Stock

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Corohmni

South Africa . 119 parts In-Stock

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$0.065

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$0.108

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$0.103

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Argo Parts USA

USA . 2,057 parts In-Stock

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Microchip USA

USA . 152 parts In-Stock

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$0.699

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Benley Electronics

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$1.750

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Aztec Data Supply Inc.

USA . 4,955 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Kulean Microsystems

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SupplyDigital Components

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Continental Prestige Electronics

USA . 2,764 parts In-Stock

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S.R.D Solutions

India . 2,000 parts In-Stock

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TANS Electronics

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Problanco Electronics

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UHIMA Technologies

Türkiye . 561 parts In-Stock

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ChipTracer

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Netroflash

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Overview

Unleash the power of cutting-edge technology with the MC74VHC1G05DTT1G logic gate by Onsemi. Crafted with precision and expertise, this innovative product offers unmatched reliability and performance. Ideal for a wide range of applications, this logic gate is designed to meet the diverse needs of modern electronics. Experience seamless operation and unparalleled efficiency with the MC74VHC1G05DTT1G, setting a new standard in the world of logic gates. Elevate your projects and unlock endless possibilities with this top-of-the-line product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy PCB assembly and compact design, saving valuable space on the board.

Nominal Supply Voltage / Vsup (V): 3

The 3V supply voltage is common and readily available, ensuring compatibility with a wide range of circuits and power sources.

Propagation Delay (tpd): 14.5 ns

With a low propagation delay, this logic gate can process signals quickly and efficiently, making it suitable for high-speed applications.

Minimum Operating Temperature: -55 °C

The wide temperature range allows this logic gate to function reliably in extreme conditions, making it suitable for industrial and automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of this logic gate.

Technical Specifications

Logic Gates MC74VHC1G05DTT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

MC74VHC1G05DTT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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