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MC74LVX50DR2

Onsemi

MC74LVX50DR2 by Onsemi

MC74LVX50DR2 by Onsemi is a Logic Gates IC with 6 functions, 11.5 ns propagation delay, and 3.3V power supply. It has a small outline package style and is suitable for industrial applications requiring fast signal processing in a compact form factor.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,667 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

3,667

-

$0.092

$0.077

$0.068

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,338 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

-

2,338

$0.072

-

-

-

Vyrian

USA . 3,114 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,114

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 152 parts In-Stock

1+ parts

$0.068

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$0.068

-

-

-

Corohmni

South Africa . 125 parts In-Stock

1+ parts

$0.076

100+ parts

-

1k+ parts

-

10k+ parts

-

125

$0.076

-

-

-

AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$11.680

100+ parts

-

1k+ parts

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-

779

$11.680

-

-

-

Microchip USA

USA . 5,632 parts In-Stock

1+ parts

-

100+ parts

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5,632

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-

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SupplyDigital Components

Austria . 5,399 parts In-Stock

1+ parts

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5,399

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Kulean Microsystems

USA . 4,256 parts In-Stock

1+ parts

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100+ parts

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4,256

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TANS Electronics

Latvia . 4,171 parts In-Stock

1+ parts

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100+ parts

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4,171

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Continental Prestige Electronics

USA . 3,667 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.066

10k+ parts

-

3,667

-

-

$0.066

-

Problanco Electronics

Mexico . 1,156 parts In-Stock

1+ parts

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100+ parts

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1,156

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UHIMA Technologies

Türkiye . 289 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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289

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Overview

Unleash the power of efficient logic gates with the MC74LVX50DR2 by Onsemi. Crafted with precision and reliability in mind, this innovative product offers seamless integration and high-performance capabilities for a wide range of applications. From industrial automation to consumer electronics, experience faster signal processing and reduced power consumption with this top-of-the-line solution. Trust Onsemi's expertise and quality assurance to deliver unmatched value and benefits to meet your unique needs. Elevate your projects with the MC74LVX50DR2 and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Propagation Delay At Nominal Supply: 11.5 ns

A low propagation delay ensures quick response times, making this product efficient for time-sensitive applications.

Surface Mount: YES

Being surface mountable makes the installation process easier and saves space on the PCB.

No. of Functions: 6

Having 6 functions in one device offers versatility and flexibility in designing circuits.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V makes it energy efficient and suitable for low-power applications.

Load Capacitance (CL): 50 pF

The load capacitance value of 50 pF ensures stable and reliable performance in various circuit configurations.

Power Supplies (V): 3.3

Supporting power supplies of 3.3V provides compatibility with standard voltage levels in many applications.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options and integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enhances the overall compactness of the design.

Maximum I (ol): 4 Amp

The ability to handle a maximum output current of 4A ensures compatibility with a wide range of loads and devices.

Propagation Delay (tpd): 16 ns

Despite a slightly higher propagation delay, the overall performance is still efficient for most applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes it suitable for a wide range of environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and ensures reliable connections in the circuit.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and can accommodate different mounting configurations.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75mm allows for a compact overall design and ease of integration in tight spaces.

Width: 3.9 mm

The narrow width of 3.9mm contributes to space-saving on the PCB and allows for efficient use of board real estate.

Minimum Supply Voltage (Vsup): 2 V

Supporting a minimum supply voltage of 2V ensures operation even in low-power conditions, expanding the range of possible applications.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C enables reliable soldering and assembly processes.

Length: 8.65 mm

The length of 8.65mm contributes to the overall compactness of the product, ideal for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes this product suitable for harsh environments and extended operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in various applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Packing Method: TR

The TR packing method ensures secure handling and storage of the product during transportation and stocking.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise and secure connections on the PCB, enhancing overall reliability.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6V ensures compatibility with standard voltage levels and provides an operating margin for transient conditions.

Technical Specifications

Logic Gates MC74LVX50DR2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74LVX50DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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