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MC74LVX132DR2

Onsemi

MC74LVX132DR2 by Onsemi

MC74LVX132DR2 by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 19.5 ns at 3.3V, making it suitable for automotive applications requiring fast signal processing in small outline packages. The device operates b/w -40 to 125 °C and features Schmitt Trigger technology for noise immunity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,907 parts In-Stock

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Digiode

USA . 2,086 parts In-Stock

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AZTECH Wire

Italy . 142 parts In-Stock

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$13.210

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QUARKTWIN TECHNOLOGY LTD

USA . 26,324 parts In-Stock

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Microchip USA

USA . 5,667 parts In-Stock

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TANS Electronics

Latvia . 5,414 parts In-Stock

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Problanco Electronics

Mexico . 4,635 parts In-Stock

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Kulean Microsystems

USA . 3,985 parts In-Stock

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SupplyDigital Components

Austria . 1,272 parts In-Stock

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UHIMA Technologies

Türkiye . 717 parts In-Stock

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Corphita

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Corohmni

South Africa . 230 parts In-Stock

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Overview

Enhance your electronic projects with the MC74LVX132DR2 by Onsemi, a high-quality logic gate that offers precision and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this versatile component is perfect for a wide range of applications. With its fast propagation delay, low power consumption, and compact design, this logic gate provides exceptional value and performance. Trust Onsemi to deliver cutting-edge solutions for your electronics needs. Upgrade your projects with the MC74LVX132DR2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 19.5 ns

Low propagation delay ensures fast response times, making this product efficient for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, making it compatible with common mounting configurations.

Nominal Supply Voltage / Vsup (V): 2.7

The low nominal supply voltage makes the product energy-efficient and suitable for use in portable devices or low-power applications.

Power Supplies (V): 3.3

The availability of multiple power supply options provides flexibility in design and compatibility with different system requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand heat and operate reliably in harsh environments.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger improves noise immunity and signal integrity, making this product suitable for high-noise environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and fast switching speeds, making it an ideal choice for modern electronic devices.

Technical Specifications

Logic Gates MC74LVX132DR2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

19.5 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74LVX132DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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