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MC74LCX14MG

Onsemi

MC74LCX14MG by Onsemi

MC74LCX14MG by Onsemi is a CMOS Logic Gates IC with 6 functions, 6.5ns propagation delay at 2.5V, and Schmitt Trigger technology. Ideal for industrial applications requiring fast signal processing in a small outline package with surface mount capability.

Median Price

$0.304

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

350

-

$0.304

$0.252

$0.225

Distributors (In-Stock)

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Digiode

USA . 704 parts In-Stock

1+ parts

$0.237

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-

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704

$0.237

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Vyrian

USA . 3,883 parts In-Stock

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3,883

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Distributors (Availability)

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Corphita

USA . 681 parts In-Stock

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$0.224

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681

$0.224

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Corohmni

South Africa . 378 parts In-Stock

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$0.249

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378

$0.249

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AZTECH Wire

Italy . 1,072 parts In-Stock

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$8.640

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$8.640

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Microchip USA

USA . 7,041 parts In-Stock

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Problanco Electronics

Mexico . 5,643 parts In-Stock

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TANS Electronics

Latvia . 5,569 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,085 parts In-Stock

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Kulean Microsystems

USA . 4,814 parts In-Stock

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Andel Nordic

Denmark . 4,444 parts In-Stock

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SupplyDigital Components

Austria . 2,103 parts In-Stock

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UHIMA Technologies

Türkiye . 736 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the MC74LCX14MG logic gates by Onsemi. Known for their superior quality and reliability, Onsemi products are trusted by industry professionals worldwide. The MC74LCX14MG offers fast propagation delays, low power consumption, and wide operating temperature ranges, making it ideal for a variety of applications in industrial settings. Upgrade your designs with this small outline package that provides high-speed operation and efficient functionality, ensuring seamless integration and optimal performance. Choose Onsemi for cutting-edge technology and unparalleled value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the internal components of the logic gates, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 6.5 ns

With a fast propagation delay, this product can process signals quickly and efficiently, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on circuit boards, saving space and improving overall product reliability.

Package Shape: RECTANGULAR

The rectangular shape of the package provides compatibility with standard PCB layouts and makes it easy to integrate into existing designs.

Nominal Supply Voltage / Vsup (V): 2.5

The low supply voltage requirement of 2.5V makes it energy-efficient and suitable for applications where power consumption is a concern.

Schmitt Trigger: YES

Having Schmitt trigger functionality helps in improving noise immunity and signal integrity, making this product ideal for applications where signal stability is crucial.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of supply voltages, making it a versatile choice for various applications.

Technical Specifications

Logic Gates MC74LCX14MG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LCX14MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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