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MC74HCT14ANG

Onsemi

MC74HCT14ANG by Onsemi

MC74HCT14ANG by Onsemi is a logic gate with 6 functions and 1 input. It has a propagation delay of 48 ns and operates at a nominal voltage of 5V. This component is commonly used in military-grade applications due to its temperature grade and Schmitt trigger technology.

Median Price

$0.270

Lifecycle Status

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Adafruit Industries

USA . 70 parts In-Stock

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70

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Rochester

USA . 25 parts In-Stock

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$0.304

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$0.252

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$0.225

25

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Digiode

USA . 2,406 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$0.230

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Sensible Micro Corp

USA . 34,516 parts In-Stock

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Vyrian

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Extreme Components

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Right Parts Inc.

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Semicontronic

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$0.195

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$0.194

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40

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Corphita

USA . 980 parts In-Stock

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Argo Parts USA

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$0.230

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$0.223

4,980

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Netroflash

USA . 1,000 parts In-Stock

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Advanced Electronics

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Corohmni

South Africa . 330 parts In-Stock

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Component Stockers USA

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$0.140

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$0.140

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Singapore . 40 parts In-Stock

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$0.435

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$17.082

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Continental Prestige Electronics

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Overview

Discover the MC74HCT14ANG by Onsemi, an exceptional logic gate that brings quality and reliability to your projects. As a trusted manufacturer, Onsemi ensures superior performance with its cutting-edge technology and commitment to excellence. This logic gate, with its 6 functions and 1 input, opens up a world of possibilities for engineers and designers. Its low propagation delay and high-speed operation make it perfect for applications requiring quick response times. With a nominal supply voltage of 5V, this product offers optimal power efficiency. Whether you're working on industrial machinery or consumer electronics, the MC74HCT14ANG guarantees top-notch performance and seamless integration. Count on Onsemi to deliver unmatched value, benefits, and advantages for all your logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the logic gates, making them suitable for various applications.

Propagation Delay At Nominal Supply: 48 ns

With a low propagation delay of 48 ns, this product offers fast and efficient signal transmission, enhancing the overall performance of electronic circuits.

No. of Functions: 6

With six functions in a single logic gate, this product provides versatility and allows for complex logic operations, reducing the need for multiple components.

No. of Inputs: 1

Having one input simplifies the circuit design, making it easier to implement and reducing the overall complexity of the system.

Package Shape: RECTANGULAR

The rectangular package shape enables easy integration and compactness, making these logic gates suitable for space-constrained applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard electronic systems, allowing for seamless integration into various projects.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can handle moderate loads, maintaining signal integrity and minimizing signal distortion.

Power Supplies (V): 5

The 5V power supply capability ensures compatibility and ease of use with common power sources, making these logic gates widely applicable.

No. of Terminals: 14

With 14 terminals, this product offers sufficient connection options, enabling flexible and versatile circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style simplifies mounting and facilitates space-saving, making these logic gates suitable for densely populated circuit boards.

Maximum I (ol): 4 Amp

With a maximum I (ol) of 4 Amp, these logic gates can handle high output currents, providing reliable operation and robustness.

Propagation Delay (tpd): 48 ns

The 48 ns propagation delay ensures minimal signal delay, allowing efficient data processing and reducing latency in the circuit.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables reliable performance even in demanding environments with increased heat.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, these logic gates can operate reliably in extreme cold conditions.

Terminal Finish: Tin (Sn)

The tin terminal finish offers corrosion resistance and solderability, ensuring stable connections and longevity of the logic gates.

Terminal Position: DUAL

The dual terminal position allows for flexible placement and routing of connections, enabling ease of use and adapting to different circuit layouts.

Maximum Seated Height: 4.69 mm

The low maximum seated height of 4.69 mm enables compact designs, making these logic gates suitable for space-limited applications.

Width: 7.62 mm

With a width of 7.62 mm, these logic gates provide a compact footprint, saving valuable board space and facilitating efficient circuit layout.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows for flexibility in power source selection and compatibility with lower voltage systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures proper soldering during assembly, contributing to the reliability of the product.

Length: 18.86 mm

With a length of 18.86 mm, these logic gates offer a compact form factor, facilitating integration into various electronic systems.

Temperature Grade: MILITARY

Designed for military-grade applications, these logic gates meet stringent requirements for reliability, durability, and performance in harsh environments.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger enhances the noise immunity and signal stabilization capabilities of these logic gates, ensuring reliable operation in noisy environments.

Technology: CMOS

Utilizing CMOS technology, these logic gates offer low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and sturdy connections, making these logic gates suitable for applications where mechanical strength is crucial.

Packing Method: RAIL

The rail packing method simplifies storage and handling, ensuring easy identification and organization of these logic gates.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, these logic gates are compatible with standard pin headers and breadboards, facilitating prototyping and experimentation.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V ensures compatibility with various power sources and provides a wide operating voltage range for these logic gates.

Technical Specifications

Logic Gates MC74HCT14ANG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

48 ns

Propagation Delay (tpd):

48 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74HCT14ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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