Loading...

MC74HC1G14DFT2

Onsemi

MC74HC1G14DFT2 by Onsemi

MC74HC1G14DFT2 by Onsemi is a CMOS Logic Gate with 35ns Propagation Delay, 50pF Load Capacitance, and 155ns Propagation Delay. It operates at a voltage range of 2-6V and has a max I (ol) of 2A. Ideal for military-grade applications requiring Schmitt Trigger functionality in compact designs.

Median Price

$0.066

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 230 parts In-Stock

1+ parts

-

100+ parts

$0.066

1k+ parts

$0.055

10k+ parts

$0.049

230

-

$0.066

$0.055

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 131 parts In-Stock

1+ parts

$0.051

100+ parts

-

1k+ parts

-

10k+ parts

-

131

$0.051

-

-

-

Vyrian

USA . 6,156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,156

-

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 59 parts In-Stock

1+ parts

$0.046

100+ parts

-

1k+ parts

-

10k+ parts

-

59

$0.046

-

-

-

Corphita

USA . 2,042 parts In-Stock

1+ parts

$0.049

100+ parts

-

1k+ parts

-

10k+ parts

-

2,042

$0.049

-

-

-

Corohmni

South Africa . 366 parts In-Stock

1+ parts

$0.054

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$0.054

-

-

-

AZTECH Wire

Italy . 886 parts In-Stock

1+ parts

$7.584

100+ parts

-

1k+ parts

-

10k+ parts

-

886

$7.584

-

-

-

Advanced Electronics

New Zealand . 68 parts In-Stock

1+ parts

$22.901

100+ parts

$20.840

1k+ parts

$18.779

10k+ parts

-

68

$22.901

$20.840

$18.779

-

RC Electronics

USA . 100,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100,000

-

-

-

-

Kulean Microsystems

USA . 8,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,050

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,695

-

-

-

-

TANS Electronics

Latvia . 5,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,090

-

-

-

-

Problanco Electronics

Mexico . 3,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,959

-

-

-

-

SupplyDigital Components

Austria . 3,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,884

-

-

-

-

Argo Parts USA

USA . 3,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,238

-

-

-

-

Continental Prestige Electronics

USA . 2,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,056

-

-

-

-

Bastille Electronics

Australia . 870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

870

-

-

-

-

UHIMA Technologies

Türkiye . 662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

662

-

-

-

-

Microchip USA

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Overview

Experience superior performance and reliability with the MC74HC1G14DFT2 logic gate from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality components that are designed to exceed expectations. The MC74HC1G14DFT2 is perfect for a wide range of applications, offering fast propagation delays and low power consumption. With a compact package size and military-grade temperature tolerance, this logic gate provides exceptional value and benefits to customers looking for high-performance solutions. Trust Onsemi to provide you with the quality and innovation you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making it ideal for portable devices.

Propagation Delay At Nominal Supply: 35 ns

With fast propagation delay, this logic gate ensures quick signal processing.

Surface Mount: YES

Being surface mountable saves space on a PCB and simplifies the assembly process.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and orientation on a circuit board.

Nominal Supply Voltage / Vsup (V): 3

Operating at a standard voltage makes this logic gate compatible with various systems.

Load Capacitance (CL): 50 pF

This gate can easily drive loads with a capacitance of up to 50 pF.

Power Supplies (V): 2/6

Can operate within a wide range of power supply voltages, making it versatile.

No. of Terminals: 5

With 5 terminals, this logic gate can handle multiple input and output signals efficiently.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact design saves space on a PCB and allows for dense packing.

Maximum I (ol): 2 Amp

With a high output current capability, this gate can drive larger loads.

Propagation Delay (tpd): 155 ns

The propagation delay of 155 ns ensures precise signal timing.

Maximum Operating Temperature: 125 °C

Able to operate at high temperatures, suitable for industrial or harsh environments.

Minimum Operating Temperature: -55 °C

Can also function in cold temperatures, making it versatile in various conditions.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexible placement on a PCB.

Maximum Seated Height: 1.1 mm

Low profile design saves space on a PCB and allows for compact designs.

Width: 1.25 mm

Narrow width enables dense packing of components on a circuit board.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low voltages, suitable for energy-efficient applications.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during the assembly process.

Length: 2 mm

Compact length makes it suitable for space-constrained applications.

Temperature Grade: MILITARY

Suitable for demanding military applications requiring high reliability.

Schmitt Trigger: YES

Includes Schmitt Trigger functionality for noise immunity and signal conditioning.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and easy soldering during assembly.

Packing Method: TR

Tray packing method ensures safe transportation and storage of the logic gates.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables compact design and efficient signal routing on a PCB.

Maximum Supply Voltage (Vsup): 6 V

Can withstand high supply voltages, suitable for a wide range of applications.

Technical Specifications

Logic Gates MC74HC1G14DFT2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

155 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

MC74HC1G14DFT2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20