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MC74HC1G04DFT1G-L22038

Onsemi

MC74HC1G04DFT1G-L22038 by Onsemi

MC74HC1G04DFT1G-L22038 by Onsemi is a CMOS Logic Gate with 90ns Propagation Delay, 3V Supply Voltage, and 155ns Propagation Delay. It is used in applications requiring fast signal processing in compact designs due to its small outline package and low power consumption.

Median Price

$0.050

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7,500 parts In-Stock

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$0.024

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7,500

$0.024

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Adafruit Industries

USA . 50 parts In-Stock

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$0.065

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$0.060

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$0.056

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50

$0.065

$0.060

$0.056

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DigiKey

USA . 842 parts In-Stock

1+ parts

$0.280

100+ parts

$0.106

1k+ parts

$0.080

10k+ parts

$0.080

842

$0.280

$0.106

$0.080

$0.080

Rochester

USA . 11,800 parts In-Stock

1+ parts

-

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$0.035

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$0.029

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$0.026

11,800

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$0.035

$0.029

$0.026

Verical

USA . 11,800 parts In-Stock

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11,800

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Avnet

USA . 6,000 parts In-Stock

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Digiode

USA . 393 parts In-Stock

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$0.028

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393

$0.028

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Nova Conductors

Japan . 10 parts In-Stock

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$0.056

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10

$0.056

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Vyrian

USA . 7,812 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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$0.084

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$0.084

Distributors (Availability)

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Semicontronic

India . 21,856 parts In-Stock

1+ parts

$0.025

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$0.024

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$0.024

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21,856

$0.025

$0.024

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Ampacity Inc.

Singapore . 21,531 parts In-Stock

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$0.025

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Corphita

USA . 2,000 parts In-Stock

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$0.026

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$0.026

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Corohmni

South Africa . 196 parts In-Stock

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$0.029

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196

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Argo Parts USA

USA . 4,177 parts In-Stock

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$0.056

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$0.054

4,177

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$0.054

Continental Prestige Electronics

USA . 1,454 parts In-Stock

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$0.056

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Netroflash

USA . 100 parts In-Stock

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100

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$0.065

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$0.060

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$0.056

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50

$0.065

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Aztec Data Supply Inc.

USA . 17,595 parts In-Stock

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$14.853

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$14.853

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Eastek

USA . 18,000 parts In-Stock

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Glotronic Ltd.

UK . 16,800 parts In-Stock

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Kulean Microsystems

USA . 7,928 parts In-Stock

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TANS Electronics

Latvia . 7,236 parts In-Stock

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Microchip USA

USA . 4,407 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 1,842 parts In-Stock

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SupplyDigital Components

Austria . 1,455 parts In-Stock

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Overview

Discover the powerful performance of the MC74HC1G04DFT1G-L22038 by Onsemi, a top-tier manufacturer known for quality and reliability. As part of the Logic Gates category, this product offers lightning-fast propagation delay and a versatile package shape ideal for various applications. With a nominal supply voltage of 3V and maximum I (ol) of 2.6 Amp, this logic gate provides exceptional value and benefits to customers seeking high-quality components for their projects. Trust in Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 90 ns

Low propagation delay ensures fast processing and response times in logic operations.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3

Operates at a commonly used supply voltage of 3V, making it compatible with a wide range of systems and applications.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission and reception.

No. of Terminals: 5

Simple and compact design with a small number of terminals for easy connectivity and integration.

Maximum I (ol): 2.6 Amp

High output current capability allows for driving of larger loads without external drivers.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures robust performance in varying environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance for reliable connections.

Technical Specifications

Logic Gates MC74HC1G04DFT1G-L22038 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

90 ns

Propagation Delay (tpd):

155 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

MC74HC1G04DFT1G-L22038 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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