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MC74ACT86DG

Onsemi

MC74ACT86DG by Onsemi

XOR GATE; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.370

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,472 parts In-Stock

1+ parts

$0.086

100+ parts

-

1k+ parts

-

10k+ parts

-

3,472

$0.086

-

-

-

Farnell

UK . 80,868 parts In-Stock

1+ parts

$0.519

100+ parts

$0.326

1k+ parts

$0.304

10k+ parts

-

80,868

$0.519

$0.326

$0.304

-

DigiKey

USA . 62 parts In-Stock

1+ parts

$0.520

100+ parts

$0.298

1k+ parts

-

10k+ parts

-

62

$0.520

$0.298

-

-

Element14

Singapore . 718 parts In-Stock

1+ parts

$0.838

100+ parts

-

1k+ parts

$0.434

10k+ parts

$0.366

718

$0.838

-

$0.434

$0.366

Rochester

USA . 76,300 parts In-Stock

1+ parts

-

100+ parts

$0.221

1k+ parts

$0.183

10k+ parts

$0.163

76,300

-

$0.221

$0.183

$0.163

Verical

USA . 63,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.204

63,470

-

-

-

$0.204

Chip1Stop

Japan . 3,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,486

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,139 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

-

1,139

$0.205

-

-

-

Bristol Electronics

USA . 938 parts In-Stock

1+ parts

$0.750

100+ parts

$0.375

1k+ parts

$0.150

10k+ parts

-

938

$0.750

$0.375

$0.150

-

Vyrian

USA . 3,958 parts In-Stock

1+ parts

-

100+ parts

-

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3,958

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-

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ComSIT Distribution GmbH

Germany . 2,457 parts In-Stock

1+ parts

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2,457

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-

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Microfarads

USA . 886 parts In-Stock

1+ parts

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886

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ECAB

Sweden . 550 parts In-Stock

1+ parts

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550

-

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PC Components Company LLC

USA . 313 parts In-Stock

1+ parts

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313

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ACDS - Activité Composants Distribution Service

France . 165 parts In-Stock

1+ parts

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165

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Prism Electronics

USA . 105 parts In-Stock

1+ parts

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105

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Connector Distribution Corp

USA . 7 parts In-Stock

1+ parts

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7

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Right Parts Inc.

USA . 7 parts In-Stock

1+ parts

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7

-

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TME

Poland . 5 parts In-Stock

1+ parts

-

100+ parts

$0.271

1k+ parts

$0.163

10k+ parts

-

5

-

$0.271

$0.163

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 403 parts In-Stock

1+ parts

$0.174

100+ parts

-

1k+ parts

-

10k+ parts

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403

$0.174

-

-

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Corphita

USA . 1,854 parts In-Stock

1+ parts

$0.194

100+ parts

-

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10k+ parts

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1,854

$0.194

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-

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Component Stockers USA

USA . 23,264 parts In-Stock

1+ parts

$0.230

100+ parts

$0.140

1k+ parts

$0.120

10k+ parts

$0.200

23,264

$0.230

$0.140

$0.120

$0.200

Continental Prestige Electronics

USA . 718 parts In-Stock

1+ parts

$0.519

100+ parts

$0.326

1k+ parts

-

10k+ parts

-

718

$0.519

$0.326

-

-

Perfect Parts

USA . 13,679 parts In-Stock

1+ parts

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13,679

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 6,572 parts In-Stock

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6,572

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Problanco Electronics

Mexico . 6,150 parts In-Stock

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6,150

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Kulean Microsystems

USA . 5,164 parts In-Stock

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5,164

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Kepictronics

USA . 4,185 parts In-Stock

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4,185

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SupplyDigital Components

Austria . 3,931 parts In-Stock

1+ parts

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3,931

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TANS Electronics

Latvia . 3,800 parts In-Stock

1+ parts

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3,800

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UHIMA Technologies

Türkiye . 380 parts In-Stock

1+ parts

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380

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Technical Specifications

Logic Gates MC74ACT86DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74ACT86DG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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