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MC74ACT02NG

Onsemi

MC74ACT02NG by Onsemi

MC74ACT02NG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage of 5V, has a propagation delay of 10ns, and can handle a load capacitance of 50pF. Widely used in industrial applications due to its high operating temperature range from -40 °C to 85°C.

Median Price

$0.304

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 4,865 parts In-Stock

1+ parts

$0.169

100+ parts

$0.080

1k+ parts

$0.062

10k+ parts

$0.060

4,865

$0.169

$0.080

$0.062

$0.060

Rochester

USA . 3,069 parts In-Stock

1+ parts

-

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$0.304

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$0.252

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$0.225

3,069

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$0.304

$0.252

$0.225

Verical

USA . 2,444 parts In-Stock

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$0.315

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$0.315

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Digiode

USA . 2,016 parts In-Stock

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$0.161

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Vyrian

USA . 5,564 parts In-Stock

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Bristol Electronics

USA . 34 parts In-Stock

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Microfarads

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Corphita

USA . 1,051 parts In-Stock

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$0.152

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$0.152

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Corohmni

South Africa . 430 parts In-Stock

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$0.169

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430

$0.169

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AZTECH Wire

Italy . 106 parts In-Stock

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$17.140

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Kulean Microsystems

USA . 8,137 parts In-Stock

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SupplyDigital Components

Austria . 3,706 parts In-Stock

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TANS Electronics

Latvia . 3,468 parts In-Stock

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Continental Prestige Electronics

USA . 3,069 parts In-Stock

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$0.216

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Problanco Electronics

Mexico . 682 parts In-Stock

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UHIMA Technologies

Türkiye . 621 parts In-Stock

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the MC74ACT02NG by Onsemi, a top-quality Logic Gates component that offers reliable and efficient function. Manufactured by industry leader Onsemi, this product guarantees superior performance in various applications. With its advanced technology and durable construction, the MC74ACT02NG ensures optimal functionality and longevity. Upgrade your electronics with this high-quality component and experience the value and benefits it brings to your projects. Trust Onsemi for all your Logic Gates needs and enjoy unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and allows for easy handling and installation.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures fast response times, making this product suitable for high-speed applications.

No. of Functions: 4

Offers versatility with the capability to perform multiple logic functions in a single package.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage of 5V, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments where heat may be a concern.

Technical Specifications

Logic Gates MC74ACT02NG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC74ACT02NG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-663-1667, 5962016631667

NIIN

016631667

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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