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MC74AC132MELG

Onsemi

MC74AC132MELG by Onsemi

MC74AC132MELG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 15ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85 °C) and has Schmitt Trigger feature. Suitable for applications requiring fast signal processing in compact designs.

Median Price

$0.619

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,126 parts In-Stock

1+ parts

-

100+ parts

$0.608

1k+ parts

$0.504

10k+ parts

$0.450

22,126

-

$0.608

$0.504

$0.450

Verical

USA . 11,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

$0.562

11,864

-

-

$0.630

$0.562

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 357 parts In-Stock

1+ parts

$0.473

100+ parts

-

1k+ parts

-

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357

$0.473

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Vyrian

USA . 7,519 parts In-Stock

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7,519

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Distributors (Availability)

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Corphita

USA . 1,397 parts In-Stock

1+ parts

$0.448

100+ parts

-

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-

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1,397

$0.448

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-

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Corohmni

South Africa . 456 parts In-Stock

1+ parts

$0.498

100+ parts

-

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456

$0.498

-

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AZTECH Wire

Italy . 695 parts In-Stock

1+ parts

$19.920

100+ parts

-

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695

$19.920

-

-

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$37.161

100+ parts

$33.817

1k+ parts

$30.472

10k+ parts

-

600

$37.161

$33.817

$30.472

-

Continental Prestige Electronics

USA . 23,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.432

10k+ parts

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23,872

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-

$0.432

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Kulean Microsystems

USA . 5,274 parts In-Stock

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5,274

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SupplyDigital Components

Austria . 3,330 parts In-Stock

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3,330

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Problanco Electronics

Mexico . 1,407 parts In-Stock

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1,407

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TANS Electronics

Latvia . 857 parts In-Stock

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857

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Microchip USA

USA . 254 parts In-Stock

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254

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UHIMA Technologies

Türkiye . 122 parts In-Stock

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122

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Overview

Unleash the power of innovation with the MC74AC132MELG Logic Gates by Onsemi. Crafted from high-quality materials and backed by a renowned manufacturer, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this versatile logic gate provides customers with a seamless and efficient solution for their electronic circuit needs. Experience the value and benefits of top-tier technology with the MC74AC132MELG Logic Gates from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to environmental factors, ensuring the longevity of the product.

Propagation Delay At Nominal Supply: 15 ns

Low propagation delay ensures fast response time, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 4

Having multiple functions in one component helps in reducing the overall component count in a circuit, leading to a more compact and efficient design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes this logic gate compatible with a wide range of electronic devices and circuits.

Power Supplies (V): 3.3/5

Compatibility with both 3.3V and 5V power supplies allows for flexibility in designing and integrating this logic gate into different systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this logic gate can withstand harsh environmental conditions and extreme temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates MC74AC132MELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74AC132MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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