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MC74AC02NG

Onsemi

MC74AC02NG by Onsemi

MC74AC02NG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage of 3.3/5V, has a propagation delay of 8ns, and can handle a load capacitance of 50pF. Ideal for industrial applications requiring high-speed logic operations in an IN-LINE package style.

Median Price

$0.281

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,425 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

9,425

-

$0.304

$0.252

$0.225

Verical

USA . 6,225 parts In-Stock

1+ parts

-

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$0.281

6,225

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$0.281

Chip1Stop

Japan . 1,405 parts In-Stock

1+ parts

-

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$0.200

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$0.152

10k+ parts

$0.134

1,405

-

$0.200

$0.152

$0.134

Distributors (In-Stock)

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Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$0.177

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72

$0.177

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Digiode

USA . 1,184 parts In-Stock

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$0.237

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$0.237

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Vyrian

USA . 10,434 parts In-Stock

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10,434

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Bristol Electronics

USA . 250 parts In-Stock

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250

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Dan-Mar Components

USA . 250 parts In-Stock

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250

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 28 parts In-Stock

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28

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,779 parts In-Stock

1+ parts

$0.105

100+ parts

-

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7,779

$0.105

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Corohmni

South Africa . 200 parts In-Stock

1+ parts

$0.117

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200

$0.117

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.173

100+ parts

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$0.166

10k+ parts

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2,000

$0.173

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$0.166

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Argo Parts USA

USA . 2,942 parts In-Stock

1+ parts

$0.177

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$0.171

2,942

$0.177

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$0.171

Corphita

USA . 1,882 parts In-Stock

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$0.224

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1,882

$0.224

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AZTECH Wire

Italy . 103 parts In-Stock

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$21.740

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103

$21.740

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Aztec Data Supply Inc.

USA . 1,195 parts In-Stock

1+ parts

$29.969

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$29.969

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Continental Prestige Electronics

USA . 9,425 parts In-Stock

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$0.216

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9,425

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$0.216

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SupplyDigital Components

Austria . 7,346 parts In-Stock

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7,346

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TANS Electronics

Latvia . 4,817 parts In-Stock

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Problanco Electronics

Mexico . 2,048 parts In-Stock

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Kulean Microsystems

USA . 1,417 parts In-Stock

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UHIMA Technologies

Türkiye . 807 parts In-Stock

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807

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Microchip USA

USA . 351 parts In-Stock

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351

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Overview

Enhance your electronic projects with the MC74AC02NG logic gates by Onsemi. With a reputation for top-quality components, Onsemi delivers reliability and performance that customers can trust. Ideal for a wide range of applications, these logic gates offer fast propagation delays and multiple functions, making them versatile and efficient. Upgrade your circuits with the MC74AC02NG and experience the value and benefits of superior technology from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, increasing the reliability of the product.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast operation and response times, making this logic gate suitable for applications requiring quick signal processing.

No. of Functions: 4

Having 4 functions in one device provides flexibility and efficiency in circuit design, reducing the need for multiple components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power sources and ensures stable performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges allows this logic gate to be used in a wide range of environments and applications.

Technical Specifications

Logic Gates MC74AC02NG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC74AC02NG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-605-9045, 5962016059045

NIIN

016059045

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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